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IN-SITU chips

IN-SITU chips

We designs and manufactures silicon nitride membrane based MEMS chips that can be used as both static and dynamic liquid cells for in-Situ TEM work. The devices are designed to have thin nitride membrane windows and spacers. The spacer material options
Item Description

 

IN-SITU chips

Liquid Cell Chips for in-Situ TEM

We designs and manufactures silicon nitride membrane based MEMS chips that can be used as both static and dynamic liquid cells for in-Situ TEM work.  The devices are designed to have thin nitride membrane windows and spacers.  The spacer material options include dielectric, metallic, or polymeric thin films.  When two such chips are assembled together, a nanometer scale thin film of liquid can be defined in the window area between the top and bottom chips, allowing TEM analysis of liquid samples. For static liquid cells, samples need to be pre-loaded before assembly.  For dynamic liquid cells, samples can be introduced through access ports after chip assembly.

Design Features and Options:

·         The chip dimensions can be designed specifically to fit customers TEM holders.  The chips can have rectangular, square or polygonal shape in almost any dimensions.

·         The silicon nitride window on the chip can be tailored in a wide thickness range, from 10nm to 1000nm, and its shape can be rectangular, square, or round.

·         The spacer thickness can range from nanometers to micrometers.  The pattern can be defined by the end-user. Both open-side and closed-side designs can be made. Please contact us to discuss your spacer patterns.

We carries an inventory of different designs of liquid cell chips for TEM, SEM and STXM applications. Please contact us for more information and pricing.

IN-SITU LIQUID CHIP TECHNICAL DETAILS

FRAME THICKNESS


— µm

FRAME SIZE

3 mm x 3mm (for TEM)

TYPE

MEMBRANE THICKNESS (nm)

WINDOW SIZE (mm2)

 

30

0.01×0.01

Yes

INCLUDED IN EACH PACK

10 pieces chip

 

Design Features and Options:

·         The chip dimensions can be designed specifically to fit customers TEM holders.  The chips can have rectangular, square or polygonal shape in almost any dimensions.

·         The silicon nitride window on the chip can be tailored in a wide thickness range, from 30nm to 2000nm, and can be rectangular, square, or round.

·         Electrode material options include Al, Ag, Au, Cr, Pd, Pt and many other metal thin films.

We carries a large inventory of MEMS e-biasing and e-chem chips for TEM, SEM and STXM applications. Please contact us for more information and pricing.
Please contact us for further information about our MEMS chips for in-Situ TEM applications to:
victorchan@powerwaywafer.com

 


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