PAM-XIAMEN Offers GaN on Sapphire substrate

PAM-XIAMEN Offers GaN on Sapphire substrate

Xiamen Powerway Advanced Material Co.,Ltd., a leading supplier of GaN on Sapphire substrate and other related products and services announced the new availability of size 2”  is on mass production in 2017. This new product represents a natural addition to PAM-XIAMEN’s product line.

Dr. Shaka, said, “We are pleased to offer highly-resistive and undoped GaN on c-sapphire to our customers including many who are developing better and more reliable for Ohmic contact. An ohmic contact is a non-rectifying electrical junction: a junction between two conductors that has a linear current–voltage (I-V) curve as with Ohm’s law. Low resistance ohmic contacts are used to allow charge to flow easily in both directions between the two conductors, without blocking due to rectification or excess power dissipation due to voltage thresholds.. The availability improve boule growth and wafering processes.” and “Our customers can now benefit from the increased device yield expected when developing advanced transistors on a square substrate. Our GaN on Sapphire substrate are natural by products of our ongoing efforts, currently we are devoted to continuously develop more reliable products.”

PAM-XIAMEN’s improved GaN on Sapphire substrate product line has benefited from strong tech, support from Native University and Laboratory Center.

Now it shows an example as follows:

1. Epi Structures of GaN on Sapphire

1) 2″ GaN on Sapphire substrate
<Layer structure>
– 0.3um N++ GaN(Si doped) — Concentration : > 2×10^18cm-3 (highly doped)
– 1um Undoped GaN buffer — Concentration : -10^17cm-3
(Polarity: Ga-face)
– Substrate: 2″ Sapphie, C-plane off 0.1deg toward A-plane, SSP, 0.43mm(t)

 

2) 2″ GaN on Sapphire substrate
<Layer structure>
– 0.3um N++ GaN(Si doped)  — Concentration : > 2×10^18cm-3 (highly doped)
– Substrate: 2″ Sapphie, C-plane off 0.1deg toward A-plane, SSP, 0.43mm(t)

 

3) GaN on sapphire, n type
2″ dia, N -type, Si dopedThickness : 4um+/-1um
Orientation: C-axis(0001)+/-1.0o
Resistivity(300K):<0.5 ohm.cm
Dislocation Density: <5×10^8 cm-2
Substrate Structure:GaN on Sapphire(0001). Single Side Polished, Epi-ready,with atomic steps

 

4) Epi GaN Wafer on Sapphire Substrate for Schottky Diode Fabrication (PAM181101-GoS)

<Layer structure>

-Epi N-type GaN

-n+ GaN

-Buffer layer

-Sapphire Substrate

 

5) GaN on sapphire, semi-insulating(PAM181211-GOS SI)

2″ dia, Semi-insulating,Fe Doped

Thickness : 1.8um

Orientation: C-axis(0001)+/-1.0o

Resistivity(300K):>10^5ohm.cm

Substrate Structure:GaN on Sapphire(0001).

Single Side Polished, Epi-ready

XRD(102)<360arcsec

XRD(002)<300arcsec

2. About GaN on Sapphire substrate

Two alloyed ohmic contact structures for AlGaN/GaN–Ti/Al/Ti/Au and Ti/Al/Mo/Au were studied. Both structures were optimized for minimum ohmic contact resistance. Structures grown on sapphire and SiC substrates were used to investigate structural properties of ohmic contacts to AlGaN/GaN. Ohmic contacts to AlGaN/GaN on SiC showed higher contact resistance values compared to contacts to AlGaN/GaN on sapphire. Ohmic contact metals were etched on samples after annealing. The alloyed interface was studied with backside illumination under an optical microscope. Alloyed inclusions associated with threading dislocations were observed on the surface. For the AlGaN/GaN on SiC sample the inclusion density was an order of magnitude lower than for the sample on sapphire. Conductive atomic force microscopy with carbon nanotube tip was used to investigate topography and conductivity profile of the surface after ohmic contact metal removal by etching.

3. Q&A of GaN on Sapphire Substrate

C: Could you please supply for following items

1) 2″ GaN on Sapphire substrate  —– Quantity : Min. Q’ty

<Layer structure>

– 0.3um N++ GaN(Si doped)  — Concentration : > 2×10^18cm-3 (highly doped)

– 1um Undoped GaN buffer   — Concentration :  -10^17cm-3

(Polarity:  Ga-face)

– Substrate: 2″ Sapphie, C-plane off 0.1deg toward A-plane, SSP, 0.43mm(t)

2) 2″ GaN on Sapphire substrate  —– Quantity : Min. Q’ty

<Layer structure>

– 0.3um N++ GaN(Si doped)  — Concentration : > 2×10^18cm-3 (highly doped)

– Substrate: 2″ Sapphie, C-plane off 0.1deg toward A-plane, SSP, 0.43mm(t)

P: We are processing this order, however we notice that you require substrate orientation:C-plane off 0.1deg toward A-plane, SSP, 0.43mm(t).

C: They will use it for MOSCAP & ohmic contact, not LED application.If it is suitable for MOSCAP & ohmic contact,the c-plane off 0.2+/-0.1deg toward A-plane is acceptable.

P: Please well note the substrate orientation does not affect your application.What is more, we do not change your original orientation,we just tell you the orientation should have tolerance

Key Words: GaN on Sapphire substrate, Ohmic contact, MOSCAP, LED application

For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com.

Share this post