2-2.Wafer Thickness, Center Point

2-2.Wafer Thickness, Center Point

Thin (thickness depends on wafer diameter, but is typically less than 1mm),circular slice of single-crystal semiconductor material cut from the ingot of single crystal semiconductor; used in manufacturing of semiconductor devices and integrated circuits; wafer diameters may range from 5mm to 300mm.

Measured with ANSI certied non-contact tools at the center of each individual wafer.

 

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