2-10.Cracks
A fracture or cleavage of the wafer that extends from the frontside surface of the wafer to the back-side surface of the wafer. Cracks must exceed 0.010” in length under high intensity illumination in order to discriminate fracture lines from allowable crystalline striations. Fracture [...]
2018-06-28meta-author
5-6-4-1-1 SiC Schottky Power Rectifiers.
4H-SiC power Schottky diodes (with rated blocking voltages up to 1200 V and rated on-state currents up to 20 A as of this writing) are now commercially available . The basic structure of these unipolar diodes is a patterned metal [...]
2018-06-28meta-author
2-15.Orange Peel
Visually detectable surface roughening when viewed under diffuse illumination.
2018-06-28meta-author
5-5-4 Patterned Etching of SiC for Device Fabrication
At room temperature, there are no known conventional wet chemicals that etch single-crystal SiC. Most
patterned etching of SiC for electronic devices and circuits is accomplished using dry etching techniques.
The reader should consult References 122–124 which contain summaries [...]
2018-06-28meta-author
2-6.Wafer Primary Flat
The flat of longest length on the wafer, oriented such that the chord is parallel with a specified low index crystal plane; major flat.
The primary at is the {10-10} plane with the at face parallel to the <11-20> direction.
2018-06-28meta-author
5-4-2 Growth of 3C-SiC on Large-Area (Silicon) Substrates
Despite the absence of SiC substrates, the potential benefits of SiC hostile-environment electronics nevertheless drove modest research efforts aimed at obtaining SiC in a manufacturable wafer form.Toward this end, the heteroepitaxial growth of single-crystal SiC layers on [...]
2018-06-28meta-author