2-21.Usable Area
A cumulative subtraction of all noted defect areas from the frontside wafer quality area within the edge exclusion zone. The remaining percent value indicates the proportion of the frontside surface to be free of all noted defects (does not include edge exclusion).
2-15.Orange Peel Visually detectable surface roughening when viewed under diffuse illumination.
5-4-1 Historical Lack of SiC Wafers Reproducible wafers of reasonable consistency, size, quality, and availability are a prerequisite for commercial mass production of semiconductor electronics. Many semiconductor materials can be melted and reproducibly recrystallized into large single crystals with the aid of a seed crystal, such as [...]
5-4-4-1 SiC Epitaxial Growth Processes An interesting variety of SiC epitaxial growth methodologies, ranging from liquid-phase epitaxy, molecular beam epitaxy, and chemical vapor deposition(CVD) have been investigated . The CVD growth technique is generally accepted as the most promising method for attaining epilayer reproducibility, quality, [...]
2-4.Wafer Surface Orientation Denotes the orientation of the surface of a wafer with respect to a crystallographic plane within the lattice structure. In wafers cut intentionally “off orientation”, the direction of cut is parallel to the primary at, away from the secondary at. Measured with [...]
5-1 Introduction Silicon carbide (SiC)-based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and high-radiation conditions under which conventional semiconductors cannot adequately perform. Silicon carbide’s ability to function under such extreme conditions is expected to enable significant improvements to a far-ranging variety [...]
2-10.Cracks A fracture or cleavage of the wafer that extends from the frontside surface of the wafer to the back-side surface of the wafer. Cracks must exceed 0.010” in length under high intensity illumination in order to discriminate fracture lines from allowable crystalline striations. Fracture [...]
