2-21.Usable Area
A cumulative subtraction of all noted defect areas from the frontside wafer quality area within the edge exclusion zone. The remaining percent value indicates the proportion of the frontside surface to be free of all noted defects (does not include edge exclusion).
5-6-2 SiC RF Devices The main use of SiC RF devices appears to lie in high-frequency solid-state high-power amplification at frequencies from around 600 MHz (UHF-band) to perhaps as high as a few gigahertz (X-band). As discussed in far greater detail in References 5, 6, [...]
2-35.Prime Grade Prime Grade:The highest grade of a silicon carbide wafer. SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Prime Wafers”.
5-4-1 Historical Lack of SiC Wafers Reproducible wafers of reasonable consistency, size, quality, and availability are a prerequisite for commercial mass production of semiconductor electronics. Many semiconductor materials can be melted and reproducibly recrystallized into large single crystals with the aid of a seed crystal, such as [...]
1-2.Stacking Sequence If we are going to make a laminated structure, we must know the thickness of each ply and the angle of each ply traditionally in degrees defined from the top layer down.
3-11. Particles Particles have the appearance of eyes and if present are usually concentrated at the wafer edges and not within the speci ed area. If present, count once per occurrence.Two particles within 200 microns count as one.
