2-36.Reclaim Grade
Reclaim Grade:A lower quality wafer that has been used in manufacturing and then reclaimed , etched or polished, and then used a second time in manufacturing.
2-36.Reclaim Grade
Related Posts
5-3-3 System Benefits of High-Power High-Temperature SiC Devices
5-3-3 System Benefits of High-Power High-Temperature SiC Devices Uncooled operation of high-temperature and high-power SiC electronics would enable revolutionary improvements to aerospace systems. Replacement of hydraulic controls and auxiliary power units with distributed “smart” electromechanical controls capable of harsh ambient operation will enable substantial jet-aircraft weight savings, reduced [...]
2018-06-28meta-author
2-8.Secondary Flat Orientation
2-8.Secondary Flat Orientation A at of shorter length than the primary orientation at,whose position with respect to the primary orientation at identies the face of the wafer.
2018-06-28meta-author
5-4-3 Growth of Hexagonal Polytype SiC Wafers
5-4-3 Growth of Hexagonal Polytype SiC Wafers In the late 1970s, Tairov and Tzvetkov established the basic principles of a modified seeded sublimation growth process for growth of 6H-SiC. This process, also referred to as the modified Lely process,was a breakthrough for SiC in that [...]
2018-06-28meta-author
2-27.BOW
2-27.BOW Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where the reference plane is defined by three corners of equilateral triangle. This definition is based on now obsolete [...]
2018-06-28meta-author
5-2-2-1 SiC Crystallography: Important Polytypes and Definitions
5-2-2-1 SiC Crystallography: Important Polytypes and Definitions Silicon carbide occurs in many different crystal structures, called polytypes. A more comprehensive introduction to SiC crystallography and polytypism can be found in Reference 9. Despite the fact that all SiC polytypes chemically consist of 50% carbon atoms covalently bonded [...]
2018-06-28meta-author
2-34.Chemical Mechanical Polishing
2-34.Chemical Mechanical Polishing Chemical Mechanical Polishing/Planarization is short as CMP, a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
2018-06-28meta-author