2-4.Wafer Surface Orientation
Denotes the orientation of the surface of a wafer with respect to a crystallographic plane within the lattice structure.
In wafers cut intentionally “off orientation”, the direction of cut is parallel to the primary at, away from the secondary at.
Measured with x-ray goniometer on a sample of one wafer per ingot in the center of the wafer.
In optics the refractive index (or index of refraction) n of a substance (optical medium) is a number that describes how light, or any other radiation, propagates through that medium. Refractive index is the basic property of optical crystals, and it is an important parameter [...]
2-7.Primary Flat Orientation The at of the longest length on the wafer, oriented such that the chord is parallel with a specied low index crystal plane. Measured on one wafer per ingot using Laue back-reection technique with manual angle measurement.
5-5 SiC Device Fundamentals To minimize the development and production costs of SiC electronics, it is important that SiC device fabrication takes advantage of existing silicon and GaAs wafer processing infrastructure as much as possible. As will be discussed in this section, most of the [...]
5-2-1-2 Electrical Properties Owing to the differing arrangement of Si and C atoms within the SiC crystal lattice, each SiC polytype exhibits unique fundamental electrical and optical properties. Some of the more important semiconductor electrical properties of the 3C, 4H, and 6H SiC polytypes are given in [...]
5-5-1 Choice of Polytype for Devices As discussed in Section 4, 4H- and 6H-SiC are the far superior forms of semiconductor device quality SiC commercially available in mass-produced wafer form. Therefore, only 4H- and 6H-SiC device processing methods will be explicitly considered in the rest [...]
5-3-3 System Benefits of High-Power High-Temperature SiC Devices Uncooled operation of high-temperature and high-power SiC electronics would enable revolutionary improvements to aerospace systems. Replacement of hydraulic controls and auxiliary power units with distributed “smart” electromechanical controls capable of harsh ambient operation will enable substantial jet-aircraft weight savings, reduced [...]
