THz Generation Process in LT-GaAs
Optical down-conversion is the most successful commercial technique for THz generation using Low temperature grown GaAs (LT-GaAs). The technique is often known as Terahertz Time-Domain Spectroscopy (THz-TDS). This technique works by optical pulse excitation of a photoconductive switch. Here, a [...]
PAM XIAMEN offers Glass Substrates(Mo-Coated sodalime Glass and TiO2 Coated Sodalime Glass and ZnO Coated Sodalime Glass).
Mo-Coated sodalime Glass
Mo-coated Sodalime Glass, 100 mm(L) x 100 mm(W) x 1.1 mm thk
Mo-coated Sodalime Glass, 20 mm(L) x 15 mm(W) x 0.7 mm th [...]
2019-04-18meta-author
PAM XIAMEN offers 2″ Diameter Wafer-2″ wafers(111).
2″ Diameter Wafer
2″ wafers(111)
Ge <111> undoped
Ge Wafer . Undoped, 2″ dia x 0.5 mm, 1SP (111) R >50 ohm.cm
Ge Wafer . Undoped, 2″ dia x 0.5 mm, 2SP (111) R >50 Ohm.cm
Ge<111> [...]
2019-04-23meta-author
PAM XIAMEN offers 4″ Silicon Wafer.
Material
Orient.
Diam.
Thck
(μm)
Surf.
Resistivity
Ωcm
Comment
p-type Si:B
[100]
4″
300
P/P
5-10
SEMI Test, Scratched and unsealed. Can be re-polished for extra fee
p-type Si:B
[100]
4″
380
P/E
5-10
SEMI TEST (in Opened cassette), 2Flats
p-type Si:B
[100]
4″
380
P/E
5-10
SEMI Prime
p-type Si:B
[100]
4″
380
P/E
5-10
SEMI TEST (with bad surface)
p-type Si:B
[100]
4″
380
P/E
5-10
SEMI Prime, hard cst, Back-side slightly darker than normal
p-type Si:B
[100]
4″
380
P/E
5-10
SEMI Test, Dirty wafers, can be cleaned for extra fee
p-type Si:B
[100]
4″
380
BROKEN
5-10
Broken P/E Wafers, [...]
2019-03-05meta-author
The Schottky barrier heights of Ti/Au contacts on p-type GaAs, grown on (111)A and (100) GaAs substrates by molecular beam epitaxy, have been investigated by I-V and C-V techniques. Higher barrier heights are observed for contacts on (111)A GaAs films. Comparison between our results [...]
2019-10-21meta-author
PAM XIAMEN offers 4″CZ Prime Silicon wafer-16
4″ CZ Silicon Wafer SSP
Silicon wafers, per SEMI Prime,
P/E 4″Ø×525±25μm, SEMI Flats (two),
p-type Si:B[100]±0.5°, Ro=(0.001-0.002)Ohmcm,
One-side-polished, back-side Alkaline etched,
TTV<5μm, Bow/Warp<30μm,
Wafers free of striation marks,
Sealed in Empak or equivalent cassette.
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
2021-01-06meta-author