PAM XIAMEN offers 2″ Silicon Wafer.
| Material | Orient. | Diam. | Thck (μm) |
Surf. | Resistivity Ωcm |
Comment |
| Intrinsic Si:- | [100-4.0°] ±0.5° | 2″ | 400 | P/E | FZ >20,000 | SEMI Prime, TTV<5μm |
| Intrinsic Si:- | [100] | 2″ | 400 | P/E | FZ >20,000 | SEMI Prime, TTV<5μm |
| Intrinsic Si:- | [100] | 2″ | 200 | P/P | FZ >10,000 | SEMI Prime |
| Intrinsic Si:- | [100] | 2″ | 350 | P/P | FZ >10,000 | SEMI Test, Wafers with edge chips |
| Intrinsic Si:- | [100] | 2″ | 500 ±10 | P/E | FZ >10,000 | SEMI Prime |
| Intrinsic Si:- | [100] | 2″ | 500 ±10 | P/E | FZ >10,000 | SEMI Prime |
| Intrinsic Si:- | [100] | 2″ | 500 ±10 | P/E | FZ >10,000 | SEMI Prime |
| Intrinsic Si:- | [100] | 2″ | 300 | P/E | FZ 5,000-10,000 | SEMI Prime |
| Intrinsic Si:- | [100] | 2″ | 300 | P/E | FZ 5,000-10,000 | SEMI Prime, in hard cassettes of 2 & 5 wafers |
| Intrinsic Si:- | [111] ±0.5° | 2″ | 330 | P/P | FZ >20,000 | SEMI |
| Intrinsic Si:- | [111] ±0.5° | 2″ | 330 | P/P | FZ >20,000 | SEMI |
| Intrinsic Si:- | [111] ±0.5° | 2″ | 350 | P/E | FZ >20,000 | SEMI Prime |
| Intrinsic Si:- | [111] ±0.5° | 2″ | 350 | P/E | FZ >20,000 | SEMI Prime |
| Intrinsic Si:- | [111] ±0.5° | 2″ | 280 | P/P | FZ >12,000 | SEMI Prime |
| p-type Si:B | [110] ±0.5° | 2″ | 300 | P/E | 5-10 | SEMI Prime |
| p-type Si:B | [110] ±0.5° | 2″ | 500 | P/E | 1-30 | 1Flat |
| p-type Si:B | [110 towards[111A]] ±0.5° | 2″ | 254 | P/E | 0.05-0.07 | SEMI Prime, , TTV<5μm, Primary Flat @ (111), SF @ (111) 70.5° CW from PF |
| p-type Si:B | [100] | 2″ | 300 | P/P | 10-20 | SEMI Prime, |
| p-type Si:B | [100] | 2″ | 300 | P/E | 5-10 | SEMI Prime |
| p-type Si:B | [100] | 2″ | 300 | P/E | 5-10 | SEMI, in hard cassettes of 1, 2, 3 & 3 wafers |
| p-type Si:B | [100] | 2″ | 250 | P/P | 1-5 | SEMI Prime |
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.