PAM XIAMEN offers 3″ Silicon Wafer-16 as follows, while silicon wafer list includes, but not limited to the following.
3″ Si wafer, R≤100Ωcm
1. Diameter: 76.2 ± 0.1mm
2. The type of alloying: P/type boron
3. Orientation (111) ±0.5º
4. Disorientation 4°±0.5º to <110> direction
5. Resistivity: ≤100Ωcm
6. Primary surface: semi std
7. Secondary surface: none
8. Thickness: 380±25μm
9. Overall thickness variation on the plate is not more than 10 microns
10. Bow ≤30μm
11. Surface: one side polishing
12. Laser mark: no
For more polished wafer specification, please see below link:
For 3″ Silicon Wafer-16 please see below link:
link 1. 3″ Silicon Wafer-1
link 2.3″ Silicon Wafer-2
link 3.3″ Silicon Wafer-3
link 4.3″ Silicon Wafer-4
About Xiamen Powerway Advanced Material Co., Ltd
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of compound semiconductor material in China.
PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.
PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
For almost 30 years, PAM-XIAMEN aims to manufacture monocrystalline silicon wafer from the pulling process to
get the ingot up to the final step which is the cleaning process, and vertically integrating to epi growth(silicon epi wafer) .
This production and epi growth flow allows to maintain a reliable and qualitative consistency.
Welcome you to enquire our engineer team, and we will give you full technology support.
Powerway Wafer Co.,Limited is a sub company of Xiamen Powerway Advanced Material Co., Ltd specializing in dealing with overseas orders.
What is the application of silicon wafer?
Monocrystalline silicon wafer is mainly used to make semiconductor components, its detail application: it is the raw material of semiconductor silicon device,
used for making high power rectifier, high power transistor, diode, switch device, etc.
Monocrystalline silicon grown by Czochralski method is mainly used in semiconductor integrated circuit, diode, epitaxial wafer substrate and solar cell.
Zone melting single crystal is mainly used in the field of high-voltage high-power controllable rectifier devices, widely used in high-power power transmission
and transformation, electric locomotive, rectifier, frequency conversion, electromechanical integration, energy-saving lamp, television and other products.
Epitaxial wafer are mainly used in the field of integrated circuits
Are you looking for an Silicon Wafer?
PAM-XIAMEN is your go-to place for semiconductor wafers, including Silicon wafers,
as we have been doing it for almost 30 years! Send us enquiry to learn more about the wafers that we offer and how we can help you with your next project.