3-12. Silicon Droplets
Silicon droplets can appear as either small mounds or depressions in the wafer surface. Normally absent, but if present are largely concentrated at perimeter of wafer. If present, estimate the % of speci ed area affected.
2018-06-28meta-author
5-4-4-1 SiC Epitaxial Growth Processes
An interesting variety of SiC epitaxial growth methodologies, ranging from liquid-phase epitaxy, molecular beam epitaxy, and chemical vapor deposition(CVD) have been investigated . The CVD growth technique is generally accepted as the most promising method for attaining epilayer reproducibility, quality, [...]
2018-06-28meta-author
2-9.(Area) Wafer Contamination
Any foreign matter on the surface in localized areas which is revealed under high intensity (or diffuse) illumination as discolored, mottled, or cloudy appearance resulting from smudges, stains or water spots.
2018-06-28meta-author
2-2.Wafer Thickness, Center Point
Thin (thickness depends on wafer diameter, but is typically less than 1mm),circular slice of single-crystal semiconductor material cut from the ingot of single crystal semiconductor; used in manufacturing of semiconductor devices and integrated circuits; wafer diameters may range from 5mm to [...]
2018-06-28meta-author
2-13.Hex Plate
Hexagonal shaped platelets on the surface of the wafer which appear silver in color to the unaided eye, under diffuse illumination.
2018-06-28meta-author
Most analog signal conditioning and digital logic circuits are considered “signal level” in that individual transistors
in these circuits do not typically require any more than a few milliamperes of current and <20 V to function properly.
Commercially available silicon-on-insulator circuits can perform complex digital and [...]
2018-06-28meta-author