3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
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3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
3-8. 3C Inclusions Regions where step- ow was interrupted during epi layer growth. Typical regions are generally triangular although more rounded shapes are sometimes seen. Count once per occurrence. Two inclusions within 200 microns count as one.
2-13.Hex Plate Hexagonal shaped platelets on the surface of the wafer which appear silver in color to the unaided eye, under diffuse illumination.
5-4-1 Historical Lack of SiC Wafers Reproducible wafers of reasonable consistency, size, quality, and availability are a prerequisite for commercial mass production of semiconductor electronics. Many semiconductor materials can be melted and reproducibly recrystallized into large single crystals with the aid of a seed crystal, such as [...]
2-12.Edge Exclusion The outer annulus of the wafer is designated as wafer handling area and is excluded from surface nish criteria (such as scratches, pits, haze, contamination, craters,dimples, grooves, mounds, orange peel and saw marks). This annulus is 2 mm for 76.2 mm substrates, and [...]
2-6.Wafer Primary Flat The flat of longest length on the wafer, oriented such that the chord is parallel with a specified low index crystal plane; major flat. The primary at is the {10-10} plane with the at face parallel to the <11-20> direction.
3-9. Comet Tails Comet tails have a discrete head and trailing tail. These features are aligned parallel to the major at. Usually, all comet tails tend to be of the same length. Count once per occurrence. Two comet tails within 200 microns count as [...]