3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
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3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
2-12.Edge Exclusion The outer annulus of the wafer is designated as wafer handling area and is excluded from surface nish criteria (such as scratches, pits, haze, contamination, craters,dimples, grooves, mounds, orange peel and saw marks). This annulus is 2 mm for 76.2 mm substrates, and [...]
5-7 Future of SiC It can be safely predicted that SiC will never displace silicon as the dominant semiconductor used for the manufacture of the vast majority of the world’s electronic chips that are primarily low-voltage digital and analog chips targeted for operation in normal [...]
3-9. Comet Tails Comet tails have a discrete head and trailing tail. These features are aligned parallel to the major at. Usually, all comet tails tend to be of the same length. Count once per occurrence. Two comet tails within 200 microns count as [...]
5-5-5 SiC Insulators: Thermal Oxides and MOS Technology The vast majority of semiconductor-integrated circuit chips in use today rely on silicon metal-oxide– semiconductor field-effect transistors (MOSFETs), whose electronic advantages and operational device physics are summarized in Katsumata’s chapter and elsewhere . Given the extreme usefulness and success of [...]
2-5.Misorientation In wafers cut intentionally “off orientation”, the angle between the projection of the normal vector to the wafers surface onto a {0001} plane and the projection on that plane of the nearest <11-20> direction.
1-6.Refraction Index In optics the refractive index (or index of refraction) n of a substance (optical medium) is a number that describes how light, or any other radiation, propagates through that medium. Refractive index of materials varies with the wavelength. This is called dispersion; it causes [...]