3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
Leading manufacturer of compound semiconductor material in China
3-7. ID Correct and Major Wafer Flat
Both should be readily discernible.
2-10.Cracks A fracture or cleavage of the wafer that extends from the frontside surface of the wafer to the back-side surface of the wafer. Cracks must exceed 0.010” in length under high intensity illumination in order to discriminate fracture lines from allowable crystalline striations. Fracture [...]
1-4.Density The mass density or density of a material is its mass per unit volume. The symbol most often used for density is ρ (the lower case Greek letter rho). Mathematically, density is defined as mass divided by volume:
2-13.Hex Plate Hexagonal shaped platelets on the surface of the wafer which appear silver in color to the unaided eye, under diffuse illumination.
3-8. 3C Inclusions Regions where step- ow was interrupted during epi layer growth. Typical regions are generally triangular although more rounded shapes are sometimes seen. Count once per occurrence. Two inclusions within 200 microns count as one.
2-25.FWHM Full width at half maximum (FWHM) is an expression of the extent of a function, given by the difference between the two extreme values of the independent variable at which the dependent variable is equal to half of its maximum value.
Saturation velocity is the maximum velocity a charge carrier in a semiconductor, generally an electron, attains in the presence of very high electric fields[1]. Charge carriersnormally move at an average drift speed proportional to the electric field strength they experience temporally. The proportionality constant [...]