3″ Si wafer Thickness: 380±20μm

3″ Si wafer Thickness: 380±20μm

PAM XIAMEN offers 3″ Si wafer Thickness: 380±20μm.

3″ Si wafer with Thermal Oxide of thickness 1000A
Diameter: 3″
Diameter: 76.2±0.3mm
Thickness: 380±20μm
Orientation: <100>±1°
Type/dopant: N type/Phosphorus
Resistivity: 1-20Ωcm
Polishing: SSP
Primary Flat 22.5±2.5mm, (110)±1°
Surface roughness: <5A

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.

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