12″ Prime Grade Silicon Wafer

PAM-XIAMEN offer 300mm bare silicon wafers (12 inch) in prime grade, n type or p type, and the 300mm silicon wafer thickness is 775±15. Compared to other silicon wafer suppliers, Powerway Wafer’s silicon wafer price is more competitive with higher quality. 300mm silicon wafers have a higher yield per wafer than pervious large diameter silicon wafers.

  • Description

Product Description

PAM-XIAMEN offer 300mm bare silicon wafers (12 inch) in prime grade, n type or p type, and the 300mm silicon wafer thickness is 775±15. Compared to other silicon wafer suppliers, Powerway Wafer’s silicon wafer price is more competitive with higher quality. 300mm silicon wafers have a higher yield per wafer than pervious large diameter silicon wafers. Size on/above 8 inches (200 mm) is called a large silicon wafer. The production technology of large silicon wafer is not only the increase of process complexity because of the increase of area, but also the higher requirements on many other control factors. For example: oxygen content and its radial uniformity in wafer, impurity control, OISF control, etc. The silicon wafer requirements for defect control, oxygen precipitation control, resistance quantification, doping and radial uniformity are also higher. Especially for prime grade 300mm silicon wafer, some parameters are required critically, for instant, wafer TTV is below1.5um and defect density ~0/cm2. The next step is 450mm silicon ingot or wafer.

 

1. Parameters of 300mm Silicon Wafer

ParametersValue(PAM210512-300-SIL)
Type of ingotGrown according to the Czochralski method
Diametr, mm300 ± 0,2
DopantB (boron)
Conductivity typeP
Oxigen max, OLD-PPMA40
Carbon , PPMA1
Crystallographic orientation<100>
Deviation from the predetermined surface orientation of crystal plane, deg1
Volume resistivity, Ohm · cm8-12
Primary NotchYes
Notch Location110
Notch size, mm2,3
Notch FormV
Wafer thickness, microns775±15
Type of markingLaser
Marking Locationback side
Edge profileby SEMI T/4
Scratches on the front sideabsent
Front side polishingyes
Back side polishingyes
Total change in wafer thickness (TTV), micrometers1,5
Deflection (WARP), microns30
The number of particles on a surface larger than 0.05 microns50
The number of particles on a surface larger than 0.09 microns30
Surface content of aluminium, E10AT/CM21
Surface content of calcium, E10AT/CM21
Surface content of chromium, E10AT/CM21
Surface content of copper, E10AT/CM21
Surface content of iron, E10AT/CM21
Surface content of potassium, E10AT/CM21
Surface content of natrium, E10AT/CM21
Surface content of nickel, E10AT/CM21
Surface content of zinc, E10AT/CM21

 

Packing requirements:

Parameters 
Type of packagingMW300GT-A
Inner Container MaterialPolyethylene
Outer Packing MaterialAluminum
Number of pieces in one package25
ReusabilityYes

 

2. FAQ: 

Q: Please take note that we offer “The number of particles on a surface larger than 0.09 microns  50” just for silicon substrate.

Normally the particle requirement is for silicon substrate.

To ensure the compliance, could you please check?

A: We double-checked: Yes, the indicated information is correct.

 

PAM-XIAMEN can offer you technology and wafer support.

For more information, please visit our website: https://www.powerwaywafer.com/silicon-wafer,

send us email at [email protected] and [email protected]