4″ FZ (100) intrinsic, SSP
wafer Si FZ (100)
dia 4’’ x 525µm
intrinsic
R > 20,000 ohm.cm
one side polished with SEMI Std flats
Roughness<0.5nm
For more information, send us email at [email protected] and [email protected]
PAM XIAMEN offers 4″CZ Prime Silicon Wafer Thickness 525 ± 25 µm. PRIME WAFERS SILICIUM CZ DIAMETER 4 inch (100mm+/-0.5mm) ORIENTATION <1-0-0> +/-1° THICKNESS : 525µm +/-25µm SSP TTV < 10µm – BOW < 40µm FLAT : 32.5mm TYPE P RESISTIVITY : 8 – [...]
PAM XIAMEN offers Polished silicon slab. Size: 90X200mm Thickness: 9±1mm 2 polished face 90 x 200mm Flatness <1um TTV <5um For more information, please visit our website: https://www.powerwaywafer.com, send us email at [email protected] and [email protected] Found in 1990, Xiamen Powerway Advanced Material Co., Ltd [...]
PAM XIAMEN offers Zirconium Substrate & Foil ( Polycrystalline ). Zr – Polycrystalline Substrate: 10 x 10 x0.5 mm, One sides polished Polycrystallline Zr substrate Purity: 99.5% Density: 6.52 g/cm3 Melting Point: 1855ºC Average Grain Size: 10~50 Microns ( No annealling ) Substrate dimension: 10 x 10 x0.5 [...]
PAM XIAMEN offers 4″CZ Prime Silicon Wafer-7 GG27b Silicon wafers, per SEMI Prime, P/E 4″Ø×500±25μm, FZ Intrinsic undoped Si:-[100]±0.5°, Ro=(5,000-10,000)Ohmcm, One-side-polished, back-side Alkaline etched, SEMI Flat (one), Sealed in Empak or equivalent cassette, MCC Lifetime>1,000μs. For more information, send us email at [email protected] and [email protected]
Today, among the existing semiconductor materials, diamond is one of the most promising semiconductor materials. Usually, it is used as diamond thermal management material. The article will mainly discuss the diamond from 3 parts: what is diamond, diamond material properties and its applications. 1. What Is Diamond? Diamond [...]
PAM XIAMEN offers 2″CZ Prime Silicon Wafer tem1, 100pcs Silicon wafer: i. Diameter: 50.8 mm ± 0.5 mm, ii. Thickness: 275 μm ±25μm, iii. Doping: P type iv. Orientation: (100) ± 0.5° v. TTV: ≤ 5 μm vi. Bow and Warp: ≤ 20 μm Growth: [...]
