Sic Chips
PAM-XIAMEN offer SiC substrate with Ag, Ti or Ni or Au metal layers with small chips:
1.PAM200508-SIC-AU
10×10mm SiC substrate / Ti(0.1um)-Ni(0.1um)-Au(2um), n type.
Grade: dummy
Thickness: approx. 350um
Backside surface: with metal films of Ti-Ni-Au
Metal thickness: Ti(0.1um)-Ni(0.1um)-Au(2um),
2. SiC Wafer with thermal [...]
2020-07-17meta-author
PAM XIAMEN offers3″ Silicon Wafer-15
3″ Si wafer(32825), R≤200Ωcm
1. Diameter: 76.2 ± 0.1mm
2. The type of alloying: P/type boron
3. Orientation (111) ±0.5º
4. Disorientation 4°±0.5º to <110> direction
5. Resistivity: ≤150Ωcm
6. Primary surface: semi std
7. Secondary surface: none
8. Thickness: 380±25μm
9. Overall thickness variation on the plate is [...]
2019-11-13meta-author
CZT Multi-Pixel Photon Counting Module
MPC-32 is a multi-pixel photon counting module. It can convert consecutive X-ray into digital signal in different energy region. It can reduce noise through setting electronic threshold value, thereafter reduce the influence of noise to image. Compared with traditional pseudo-dual [...]
2019-04-24meta-author
PAM XIAMEN offers 4″ Prime Silicon Wafer Thickness 675 +/- 20 microns.
Wafers 4 inches in a diameter of monocrystalline silicon with an insulating oxide.
100 mm in diameter
The silicon substrate
orientation<100>
resistivity>10Ωcm
The insulating thermal oxidation film thickness 300nm
Polishing: one-sided for [...]
2019-07-02meta-author
PAM-XIAMEN offers 4 inch Blue LED Wafer
Anticipating exploding demand for blue LED chips, Xiamen Powerway Advanced Material Co.,Ltd. (PAM-XIAMEN) shift a GaN LED production line from the current 2-inch-wafer-based operation to 4-inch-wafer facilities within a couple of years.
“We have established the production process based [...]
PAM XIAMEN offers TGG (Terbium Gallium Garnet).
TGG singlecrystal（ Terbium Gallium Garne ） is an excellent magneto-optical crystal used in various Faraday device s(Rotator and Isolator) in the range of 400nm-1100nm, excluding 475 – 500nm.
TGG Single Crystal Substrate: (111) 10 x 10 x. [...]
2019-05-20meta-author
