Silicon wafers, per SEMI Prime,
P/P 5″Ø×240±10µm,
FZ p-type Si:B[100]±0.5°,
Ro=(240-280)Ohmcm,
TTV<5µm, Bow<25µm, Warp<25µm,
Both-sides-polished,
SEMI Flat (one),
Sealed in Empak or equivalent cassette,
MCC Lifetime>1000µs.
For more information, send us email at [email protected] and [email protected]
Single-emitter LD Chip 9xxnm @15W PAM200914-LD-CHIP-976nm Brand: PAM-XIAMEN Wavelength: 9xxnm Stripe width: 96um Output Power: 15W Cavity Length:4mm For more information, please contact us email at [email protected] and [email protected]
PAM XIAMEN offers 6″ Prime Silicon Wafer Thickness 500±25um. 6″ Si wafer DSP N-type <111> thickness 500±25um resistivity40-100Ωcm For more information, please visit our website: https://www.powerwaywafer.com, send us email at [email protected] and [email protected] Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is [...]
Industrial diamond window blanks with optical transmissivity for IR-applications are commercially available. The applicable wavelengths of current diamond optical window components basically include all wavelengths from X-ray, deep ultraviolet to microwave. Therefore, there is a great significance for the development of optical windows/fairings used [...]
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Highlights •Elaboration of a smooth 3C–SiC membrane on a SiC substrate. •Faceted surface for the (110) orientation but smoother for the (111) orientation. •Roughness of the 3C–SiC membrane limited to 9 nm for the (111) orientation. •New MEMS devices feasible. •The huge SiC properties could be entirely exploited. The cubic [...]
