PAM XIAMEN offers 80+1mm FZ Si Ingot
FZ Si Ingot
Diameter 80+1mm, N-type, <111>±2°
Resistivity 1000-3000Ωcm
Oxygen/Carbon Content 10Е16см-3
The silicon content not less than 99.999999%
Length 150-480mm
MCC lifetime>1000μs
The dislocation density not, Swirl not
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
2020-03-11meta-author
PAM XIAMEN offers 4″ (100mm) black lithium niobate (LiNbO3) 127.860Y-cut black wafer for Optics and SAW components
1. Dimension
Diameter/mm
100.0±0.3
Orientation Flat (OF)/mm
32.0±1.0
Second Refer. Flat (RF)/mm
10.0±3.0
Thickness/um
350±20
Edge bevel
Edge rounding
2. Specification
2.1 Orientation
Surface – cut:
127.860Y-cut±0.30
Orientation Flat (OF)
Parallel to +X Plane±0.30
Second Refer. Flat (RF)
CCW1350±0.50from OF
2.2 Flatness
TTV
≤5um
LTV
≤0.5um within an area of 5*5mm2
PLTV
≥95% (3mm [...]
2019-02-28meta-author
PAM XIAMEN offers Silicon Wafer Thickness:275+- 25µm.
Silicon Wafer ,2in Si Wafer,P/Boron <111> ON +-1°,
0.01-0.02 Ohm-cm ,275+- 25µm Thickness,SSP,
PRIME -Si Wafers,Single SidePolished/Etched Back,
Primary Semi Std Flat,
Surface Roughness <1nm
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at [...]
2019-08-22meta-author
PAM XIAMEN offers Cleaving Silicon Wafer, which is cut by multi-wire cutting technology. Here is the cleaving silicon wafer specs:
Cleaving (100) silicon wafers
Cleaving (111) silicon wafers
Here comes a question: how to cleave a silicon wafer? At present, the silicon wafer cleaving technology mostly adopts the [...]
2019-02-22meta-author
PAM-XIAMEN offers crucibles and coating products of PBN material including PBN Crucibles,PBN Plates,PBN Coating,PBN Heaters.
These PBN (Pyrolytic Boron Nitride) products are widely used in such fields as optoelectronic,microelectronics,solar energy and powder sintering.
[...]
2018-11-01meta-author
SiC devices are made from silicon carbide(SiC) wafers. So, here comes a question: how to obtain a silicon carbide wafer? Generally, a SiC wafer is cut from cylindrical SiC boules. As for the cutting process, methods for cutting silicon carbide ingots are introduced here.
A diamond [...]
2021-04-27meta-author