76.2mm (3 Inch) Silicon Wafers

PAM XIAMEN offers 1″Si wafers. Please send us email at [email protected] if you need other specs and quantity.

ItemDiaTypeDopantOrienRes (Ohm-cm)Thick (um)PolishDescription
PAM226625.4mmPB<111>>100020000umDSPFZ
PAM226725.4mmPB<100>ANY400umSSPThickness is: 400+/-100um.
PAM226825.4mmANY<100>500umSSPWafers have particles. Wafers sold “As-Is”.
PAM226925.4mmUndopedUndoped<111>>2000280umSSPIntrinsic FZ
PAM227025.4mmUndopedUndoped<100>>500073.5umDSPFZ, Float Zone
PAM227125.4mmPB<100>.01-.05500umDSPNO flats, COMPLETELY round. Minimum Order Quantity 5 wafers.

 

ItemMaterialOrient.Diam
(mm)
Thck
(μm)
Surf.Resistivity
Ωcm
Comment
PAM2271p-type Si:B[100]1″280umP/E0-100 ohm-cmSEMI, 1Flat, Soft cst
PAM2272Intrinsic Si:-[111]1″280umP/EFZ >2000 ohm-cmTest Grade
PAM2273p-type Si:B[100]1″P/EANYTest Grade
PAM2274n-type Si:P[100]1″475 ±10E/EFZ >500 {1,900–2,400}NO Flats, Soft cst
PAM2275n-type Si:P[111] ±0.5°1″280P/PFZ 2,000–10,000NO Flats, TTV<5μm, Soft cst
PAM2276Intrinsic Si:-[100]1″500P/EFZ >20,000SEMI Prime, 1Flat, hard cst
PAM2277Intrinsic Si:-[100]1″160P/PFZ >10,000Prime, NO Flats, hard cst, TTV<8μm
PAM2278Intrinsic Si:-[100]1″160P/PFZ >10,000Prime, NO Flats, hard cst, TTV<8μm
PAM2279Intrinsic Si:-[111] ±0.5°1″500P/PFZ >17,500SEMI Prime, 1Flat, hard cst
PAM2280Intrinsic Si:-[111] ±0.5°1″500P/PFZ >15,000SEMI Prime, 1Flat, hard cst
PAM2281Intrinsic Si:-[111] ±0.5°1″1000P/EFZ 14,000–30,000NO Flats, Soft cst, Cassettes of 7, 6, 6 wafers
PAM2282Intrinsic Si:-[111] ±2°1″27870C/CFZ >10,000Single Crystal Silicon Rod, 0.39″ diameter × 27.87±0.1mm
PAM2283p-type Si:B[510]1″1000P/E1–100 {7.4–7.4}NO Flats, Soft cst
PAM2284p-type Si:B[100]1″100 ±15P/P1–10Prime, NO Flats, in sealed bags of 5 wafers.
PAM2285p-type Si:B[100]24mm300P/E1–100Prime, NO Flats, hard cst
PAM2286p-type Si:B[100]24.3mm300P/E1–10Prime, NO Flats, hard cst
PAM2287p-type Si:B[100]1″300P/E1–10 {2.8–2.9}SEMI Prime, 1Flat, Soft cst
PAM2288p-type Si:B[100]1″300P/E1–10Prime, NO Flats, Soft cst
PAM2289p-type Si:B[100]24.3mm300P/E1–10 {1.5–1.7}Prime, NO Flats, hard cst
PAM2290p-type Si:B[100]1″525 ±10P/E1–30Prime, NO Flats, Soft cst, TTV<5μm, Cassettes of 20 and 8 wafers
PAM2291p-type Si:B[100]1″1000P/E1–30SEMI Prime, 1Flat, hard cst
PAM2292p-type Si:B[100]1″3000P/E1–50Prime, NO Flats, Individual cst, Group of 13 wafers
PAM2293p-type Si:B[100]1″275P/P0.015–0.020SEMI Prime, 1Flat, hard cst
PAM2294p-type Si:B[100]1″275P/E0.015–0.020SEMI Prime, 1Flat, Soft cst
PAM2295p-type Si:B[111] ±0.5°1″50 ±10P/P1–100NO Flats, Soft cst
PAM2296n-type Si:P[100]1″50 ±10P/P>20SEMI Prime, 1Flat, TTV<5μm, in single wafer trays between clean–room sheets, MOQ 4 wafers
PAM2297n-type Si:P[100]1″280P/E1–5SEMI, 1Flat, hard cst
PAM2298n-type Si:P[100]1″1500P/E1–20Prime, NO Flats, Soft cst
PAM2299n-type Si:P[111]1″330P/EFZ >90Prime, NO Flats, hard cst
PAM2300p-type Si:B[100]1″775P/E8–12SEMI Prime, 1Flat, Soft cst
PAM2301p-type Si:B[100]1″300P/P4–6SEMI Prime, 1Flat, hard cst
PAM2302p-type Si:B[100]24mm300P/E1–100Prime, NO Flats, Soft cst
PAM2303p-type Si:B[100]1″300P/E1–10Prime, NO Flats, Soft cst
PAM2304p-type Si:B[100]1″500P/E1–10Ile zostalo ?
PAM2305p-type Si:B[100]1″380P/E0.003–0.005SEMI Prime, 1Flat, hard cst
PAM2306p-type Si:B[100]1″275P/E0.002–0.005Prime, NO Flats, hard cst
PAM2307n-type Si:P[100]1″50 ±10P/P>20SEMI Prime, 1Flat, TTV<5μm, in single wafer trays between clean–room sheets, MOQ 5 wafers
PAM2308n-type Si:P[100]1″3500P/E1.2–3.0SEMI Prime, 2Flats, Individual cst
PAM2309n-type Si:P[100]1″300P/E1–20SEMI Prime, 1Flat, hard cst
PAM2310n-type Si:As[100]1″300P/P0.001–0.005Prime, NO Flats, hard cst
PAM2311n-type Si:As[111]1″380P/E0.002–0.007SEMI Prime, 1Flat, hard cst

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at [email protected] and [email protected]

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.

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