8″ CZ Silicon Wafer SSP

8″ CZ Silicon Wafer SSP

PAM XIAMEN offers 8″ CZ Silicon Wafer SSP

Growth Method: CZ
Diameter: 200.0±0.5mm
Type/Dopant: P/Boron
Orientation: (111) ±0.5°
Resistivity: <1Ωcm
Notch: SEMI Standard
Thickness: 1,000 ±25um
TTV <6um
Bow <60um
Warp <60um
Frontside Surface: Polished
Backside Surface: Etched
Particle ≦[email protected]≧0.3um

For more information, send us email at [email protected] and [email protected]

Share this post