8″ CZ Silicon Wafer SSP

PAM XIAMEN offers 8″ CZ semiconductor grade silicon wafer SSP

Growth Method: CZ
Diameter: 200.0±0.5mm
Type/Dopant: P/Boron
Orientation: (111) ±0.5°
Resistivity: <1Ωcm
Notch: SEMI Standard
Thickness: 1,000 ±25um
TTV <6um
Bow <60um
Warp <60um
Frontside Surface: Polished
Backside Surface: Etched
Particle ≦[email protected]≧0.3um

Moreover, 8″CZ Red P doped wafer (dopant Red Phos) with resistivity<0.0016Ωcm is available. (PAM180413)

For more information, please contact us email at [email protected] and [email protected].

2021-03-18

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[email protected] [email protected]

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8″ CZ Silicon Wafer SSP

8″ CZ Silicon Wafer SSP

PAM XIAMEN offers 8″ CZ semiconductor grade silicon wafer SSP

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