FAQs

Q:We are using 40×40 mil size and 45×45 mil size chips for 1W . And 45×22 or 38x22mil size for 0,5w . Eff. is min. 120lm/w , package form is 3535 ceramic no lens flat type, and 5050 smd flat type.Cct 6500k, cri min 70-75, drive current 350 mA ( it can be change if you have suggest for it ), can you give us suggestion?

Q:We are using 40×40 mil size and 45×45 mil size chips for 1W . And 45×22 or 38x22mil size for 0,5w . Eff. is min.  120lm/w , package form is 3535 ceramic no lens flat type, and 5050 smd flat type.Cct 6500k,  cri min 70-75, drive current 350 mA ( [...]

For 4” pss wafer, the light comes out from the p-GaN side not from sapphire, so I can’t do flip chip packaging. Also I don’t know whether laser liftoff is possible for pss wafer. Is it possible you can share any image of the etched surface of pss?

Q:For 4” pss wafer, the light comes out from the p-GaN side not from sapphire, so I can’t do flip chip packaging. Also I don’t know whether laser  liftoff  is possible for pss wafer. Is it possible you can share any image of the etched surface of pss? A: 4″LED wafer on pps [...]