FP (Fabry-Perot) Laser Wafer

Fabry-Perot laser (FP-LD) is the most common semiconductor laser. At present, the fabrication technology of FP-LD used in optical fiber communication has been quite mature, and the structure of double heterojunction multiple quantum wells active layer, carrier and light limited structure is widely used. PAM-XIAMEN, one of leading epitaxy [...]

Epitaxial Growth of GaAs MESFET Heterostructure

PAM-XIAMEN provides GaAs epiwafer for MESFET devices, which is one FET epitaxial structure with modulated doping. Detailed epitaxial growth heterostructure is listed below for your reference. The electron migration rate of GaAs is 5.7 times higher than that of silicon, which is very suitable for high-frequency circuits. The electrical [...]

P Type Boron Doped Silicon Epitaxial Wafer

At present, P-P+ (boron doped) silicon epitaxial wafers are widely used in the manufacture of large-scale integrated circuits and discrete devices. The requirements for the thickness of P-P+ silicon epitaxial wafers vary with the device type. For making high-speed digital circuits, only about 0.5μm of epilayer is needed. For [...]

P Type Indium Phosphide Semiconductor Substrate

Indium phosphide (InP) is one of the III-V compound semiconductors. It is a new generation of electronic functional materials after silicon and gallium arsenide. Indium phosphide semiconductor material has many excellent properties: direct transition band structure, high photoelectric conversion efficiency, high electron mobility, easy to make semi insulating materials, [...]

405nm GaN Laser Diode Wafer

Group III nitride materials are a kind of direct band gap materials, which have the advantages of wide band gap, strong chemical stability, high breakdown electric field and high thermal conductivity. They have broad application prospects in the fields of efficient light-emitting devices and power electronic devices. Therein, by [...]

GaN Fabrication Services for HEMT Devices

PAM-XIAMEN supplies GaN HEMT epitaxial wafers and GaN fabrication services. Our GaN fabrication services supplied include front-end process and back-end process. More details about GaN fabrication process for HEMTs please see below: 1. OEM Service – Si-based GaN Epitaxial Wafers for Power and RF Electronic Devices Our GaN fab can epitaxy [...]

GaN Foundry Services for LED Fabrication

PAM-XIAMEN can offer LED epitaxy wafers and is able to offer GaN foundry services & supplies for LEDs. The GaN foundry services include OEM growth service, COW process and various test services. Specifically as follows: 1. OEM Service – Customized AlGaN-based Thin Film Epi Structure We supply 2, 4 inch DUV-LED [...]

1060nm High Power Laser Wafer

InGaAs quantum well (QW), as a commonly used two-dimensional material in near-infrared band, has important applications in semiconductor lasers, solar cells and other devices. In the field of semiconductor lasers, InGaAs/GaAs quantum well expands the luminous wavelength of GaAs (0.85~1.1 μm) and is widely used in various optoelectronic devices [...]

InGaAs Photodiode Structure

Ternary compound semiconductor material InxGa1-xAs is a mixed solid solution formed by GaAs and InAs. It is a sphalerite structure and belongs to direct bandgap semiconductor. Its energy band changes with the change of alloy and can be used to make various photoelectric devices, such as HBT, HEMTs, FET, [...]

AlGaN UV LED Wafer

AlGaN is a direct wide band gap semiconductor material. By changing the composition of AlGaN material, the band gap size can be continuously adjusted from 3.39 eV to 6.1 eV, covering the UV band range from 210 nm to 360 nm, so it is an ideal material for the [...]