Characterization of LT GaAs carrier lifetime in multilayer GaAs epitaxial wafers by the transient reflectivity technique

Characterization of LT GaAs carrier lifetime in multilayer GaAs epitaxial wafers by the transient reflectivity technique

A methodology for determining the carrier lifetime of LT GaAs buffer layers in GaAs multilayer wafers utilizing the femtosecond transient reflectivity technique is introduced. Experimental results and computer simulations performed as a function of the LT GaAs growth temperature are presented for the multilayer GaAs structures that are used for device fabrication. The markedly non-exponential nature of the measured transients is a consequence of the multilayer structure of the wafers. The carrier lifetime measurements are correlated with available SEU data measured for structures fabricated with LT GaAsbuffers with different growth temperatures

Source:IEEE

If you need more information about Characterization of LT GaAs carrier lifetime in multilayer GaAs epitaxial wafers by the transient reflectivity technique，please visit our website:https://www.powerwaywafer.com, send us email at [email protected] or [email protected].

2014-03-14 LT-GaAs

Related Posts

GaN Epitaxy Template on Sapphire

GaN epitaxy template on Sapphire substrate with N-type, P-type or semi-insulating is available for the preparation of semiconductor optoelectronic devices and electronic devices. GaN epitaxial layer on sapphire substrate refers to a composite structure composed of a gallium nitride single crystal thin film material [...]

2019-04-22meta-author

150mm&200mm Silicon Wafer

PAM XIAMEN offers 150mm&200mm Silicon Wafer. Diameter Type Dopant Growth method Orientation Resistivity Thickness Surface Grade 150 N Phos CZ -100 1-20 180-200 P/P PRIME 150 N Phos CZ -100 1-100 500-550 P/P PRIME 150 N Phos CZ -100 1-100 500-600 P/E TEST 150 N Phos CZ -100 1-100 650-700 P/E/DTOx PRIME 150 N Phos CZ -100 1-100 650-700 P/E/Ni PRIME 150 N Phos CZ -100 1-20 650-700 P/E/OX PRIME 150 N Phos CZ -100 1-20 650-700 P/E/WTOx 150 P Boron CZ -100 1-20 180-200 P/P PRIME 150 P Boron CZ -100 1-100 500-550 P/P PRIME 150 P Boron CZ -100 1-100 500-600 P/E TEST 150 P Boron CZ -100 .001-.005 650-700 P/E PRIME 150 P Boron CZ -100 1-100 650-700 P/E/DTOx PRIME 150 P Boron CZ -100 1-100 650-700 P/E/Ni PRIME 150 P Boron CZ -100 1-20 650-700 P/E/OX PRIME 150 P Boron CZ -100 1-20 650-700 P/E/WTOx 150 P Boron CZ -100 1-20 950-1050 P/E PRIME 150 P Boron CZ -100 1-20 950-1050 P/P PRIME 150 Undoped VGF -100 >1E7 500-600 P/P 150 Undoped VGF -100 >1E7 500-600 P/P 150 N Si VGF -100 650-700 P/E PRIME 150 P Zn VGF -100 650-700 P/E PRIME 150 Si Undoped VGF -100 >1E7 500-600 P/P TEST 150 Si Undoped VGF -100 >1E7 500-600 P/P TEST 150 Si Undoped VGF -100 >1E7 610-660 P/P EPI 150 Si Undoped VGF -100 >1E7 650-700 P/E PRIME 150 Single Wafer Shipper ePak Lid/Base/Spring Holds1Wafer Clean Room 150 Round Single Wafer Shipper ePak Lid/Base/Spring Holds1Wafer Clean Room 150 Shipping Cassette ePak Holds25Wafers Clean Room 200 N Phos CZ -100 1-20 700-750 P/E/OX PRIME 200 P Boron CZ -100 1-100 600-800 P/E TEST 200 P Boron CZ -100 1-20 700-750 P/E/OX PRIME For more information, please visit our website: https://www.powerwaywafer.com, send us email at [email protected] and [email protected] Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in [...]

2019-03-04meta-author

Tatalum Metal Substrate & Foil ( Polycrystalline )

PAM XIAMEN offers Tatalum Metal Substrate & Foil ( Polycrystalline ). General Properties for Tantalum Symbol Ta Atomic Number 73 Atomic Weight: 180.95 Density: 16.69 g/cm3 Melting Point: 2996 °C Boiling Point: 5425+/-100 °C Ta – Tantalum Polycrystalline Metallic Foil: 0.05mm thick x 200mm Width x 400 [...]

2019-05-20meta-author

Veeco MBE reactor for laser diodes

Veeco MBE reactor for laser diodes IPG Photonics adds 4th Veeco MBE reactor for laser diodes Aug 29, 2012 The tool will be used to manufacture gallium arsenide based devices Veeco Instruments has recently completed installation of a GEN2000 Edge MBE system at IPG Photonics Corporation. The system was delivered to [...]

2012-08-30meta-author

Gallium Oxide(Ga2O3) Wafer

PAM-XIAMEN can offer Gallium Oxide (chemical formula: Ga2O3) wafer. Currently, the third-generation semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) have received widespread attention. High hopes are placed on the application of SiC and GaN in the high power, high temperature, high pressure occasions(like new energy [...]

2021-04-19meta-author

Ag — Silver Single Crystal & Substrate

PAM XIAMEN offers high-quality Ag — Silver Single Crystal & Substrate. PAM XIAMEN grows Silver single crystal along <111> direction up to 20 mm diameter by Modified Bridgeman method. The silver single crystal substrate is cut from the Ag ingot and polished to 30A [...]

2019-04-16meta-author

Read More

Float-Zone Mono-Crystalline Silicon

PAM-XIAMEN can offer float zone silicon wafer, which is obtained by Float Zone method. Monocrystalline silicon rods is got through float zone growth, and then process the monocrystalline silicon rods into silicon wafers, called float zone silicon wafers. Since the zone-melted silicon wafer is not in contact with the quartz crucible during the floating zone silicon process, the silicon material is in a suspended state. Thereby, it is less polluted during the process of floating zone melting of silicon. The carbon content and oxygen content are lower, the impurities are less, and the resistivity is higher. It is suitable for the manufacture of power devices and certain high-voltage electronic devices.
Read More

Test Wafer Monitor Wafer Dummy Wafer

As a dummy wafer manufacturer, PAM-XIAMEN offers silicone dummy wafer / test wafer / monitor wafer, which is used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form. As dummy silicon wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions. 100mm, 150mm, 200mm, or 300mm dummy wafer is available.
Read More

Nanofabrication Photoresist

PAM-XIAMEN Offers photoresist plate with photoresist
Read More

Photo Mask

PAM-XIAMEN Offers Photomasks

A photo mask is a thin coating of masking material supported by a thicker substrate, and the masking material absorbs light to varying degrees and can be patterned with a custom design. The pattern is used to modulate light and transfer the pattern through the process of photolithography which is the fundamental process used to build almost all of today’s digital devices.
Read More

CdZnTe (CZT) Wafer

Cadmium Zinc Telluride (CdZnTe or CZT) is a new semiconductor, which enables to convert radiation to electron effectively, it is mainly used in infrared thin-film epitaxy substrate, X-ray detectors and Gamma-ray CdZnTe detectors.
Read More

Ge(Germanium) Single Crystals and Wafers

PAM-XIAMEN offers 2”, 3”, 4” and 6” germanium wafer, which is short for Ge wafer grown by VGF / LEC. Lightly doped P and N type Germanium wafer can be also used for Hall effect experiment. At room temperature, crystalline germanium is brittle and has little plasticity. Germanium has semiconductor properties. High-purity germanium is doped with trivalent elements (such as indium, gallium, boron) to obtain P-type germanium semiconductors; and pentavalent elements (such as antimony, arsenic, and phosphorus) are doped to obtain N-type germanium semiconductors. Germanium has good semiconductor properties, such as high electron mobility and high hole mobility.

[email protected] [email protected]

Read More

Float-Zone Mono-Crystalline Silicon

PAM-XIAMEN can offer float zone silicon wafer, which is obtained by Float Zone method. Monocrystalline silicon rods is got through float zone growth, and then process the monocrystalline silicon rods into silicon wafers, called float zone silicon wafers. Since the zone-melted silicon wafer is not in contact with the quartz crucible during the floating zone silicon process, the silicon material is in a suspended state. Thereby, it is less polluted during the process of floating zone melting of silicon. The carbon content and oxygen content are lower, the impurities are less, and the resistivity is higher. It is suitable for the manufacture of power devices and certain high-voltage electronic devices.
Read More

Test Wafer Monitor Wafer Dummy Wafer

As a dummy wafer manufacturer, PAM-XIAMEN offers silicone dummy wafer / test wafer / monitor wafer, which is used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form. As dummy silicon wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions. 100mm, 150mm, 200mm, or 300mm dummy wafer is available.
Read More

Nanofabrication Photoresist

PAM-XIAMEN Offers photoresist plate with photoresist
Read More

Photo Mask

PAM-XIAMEN Offers Photomasks

A photo mask is a thin coating of masking material supported by a thicker substrate, and the masking material absorbs light to varying degrees and can be patterned with a custom design. The pattern is used to modulate light and transfer the pattern through the process of photolithography which is the fundamental process used to build almost all of today’s digital devices.
Read More

CdZnTe (CZT) Wafer

Cadmium Zinc Telluride (CdZnTe or CZT) is a new semiconductor, which enables to convert radiation to electron effectively, it is mainly used in infrared thin-film epitaxy substrate, X-ray detectors and Gamma-ray CdZnTe detectors.
Read More

Ge(Germanium) Single Crystals and Wafers

PAM-XIAMEN offers 2”, 3”, 4” and 6” germanium wafer, which is short for Ge wafer grown by VGF / LEC. Lightly doped P and N type Germanium wafer can be also used for Hall effect experiment. At room temperature, crystalline germanium is brittle and has little plasticity. Germanium has semiconductor properties. High-purity germanium is doped with trivalent elements (such as indium, gallium, boron) to obtain P-type germanium semiconductors; and pentavalent elements (such as antimony, arsenic, and phosphorus) are doped to obtain N-type germanium semiconductors. Germanium has good semiconductor properties, such as high electron mobility and high hole mobility.