PAM XIAMEN offers Cu – single crystal Substrates & Polycrystalline & Copper Foam.
1. General Properties for Single Crystal Copper
Symbol : Cu
Atomic Number: 29
Atomic Weight: 63.546(3
Crystal structure: FCC -Face centered cubic
Density: 8.96 g/cm3
Melting Point: 1357.77 K (1084.62 °C, 1984.32 °F)
Boiling Point: 2835 K (2562 °C, 4643 °F)
Heat of Fusion:
Heat of vaporation: 300.4 kJ/mol
Thermal expansion: 16.5 µm/(m•K) (at 25 °C)
Thermal conductivity: 401 W/(m•K)
Electrical Resistivity: 16.78 nΩ•m (at 20 °C)
2. Specification of Cu Single Crystal
Cu Single Crystal (PAMP16112-CU)
Diameter: 15 mm;
Length: 15 mm;
Orientation: Flat planes parallel to (100) direction;
Purity: 5N;
One surface polished.
3. Specifications of Copper Single Crystal Substrate
Cu Single Crystal Substrate: (100), 5x5x1.0 mm, 1side polished
Cu Single Crystal Substrate: (110), 5x5x1.0 mm, 1side polished
Cu Single Crystal Substrate: (111), 5x5x1.0 mm, 1side polished
Cu Single Crystal Substrate: (111)with edge <110> 5x5x1.0 mm, 1side polished
PAM210827-Cu:
Cu Single Crystal Substrate: (100), 10x10x0.5 mm, 1side polished
Cu Single Crystal Substrate: (110), 10x10x0.5 mm, 1 side polished
Cu Single Crystal Substrate: (111), 10x10x0.5 mm, 1 side polished
Cu Single Crystal Substrate: (100), 10x10x1.0 mm, 1side polished
Cu Single Crystal Substrate: (110), 10x10x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (111), 10x10x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (110), 20x20x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (111), 20x20x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (100), 10mm Dia. x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (100), 2″ Dia. x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (110), 10mmDia. x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (110), 2″ Dia. x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (111), 10mmDia. x1.0 mm, 1 side polished
Cu Single Crystal Substrate: (111), 2″ Dia. x1.0 mm, 1 side polished
Cu Metallic Substrate ( polycrystalline) 10x10x0.5mm, 1 side polished PAM-190802-CU-10
Cu Metallic Substrate ( polycrystalline) 10x10x1.0mm, 1 side polished PAM-190802-CU-10
Copper Foil for Battery Anode Substrate (170 m L x 280mm W x 9um thick)
3 Pcs Copper Foam Sheet (Porous Cu) for Battery or Supercapacitor Anode Substrate (300mm length x 80mm width x 0.08mm thickness)
Copper Foil: 25um Thickness x 150mm Width x 90 Meter Length
Copper Foil: 6.0 um Thickness x 280mm Width x 333 Meter Length
Copper Foil: 6.0 um Thickness x 30mm Width x 2000 Meter Length
For more information, victorchan@powerwaywafer.com and powerwaymaterial@gmail.com