Custom Silicon Wafers
PAM XIAMEN offers custom silicon Wafers from thinning or reclaiming substrates that you already have to making silicon cubes.
We can laser cut or dice wafers into diameters and dimensions that you need.
Below is just some of the custom silicon wafer services that we provide
Low TTV (<1μm)
Low Bow/Warp (<5μm for 150mm)
Extra-Thin (100μm and thinner)
Extra-Thick (1 to 12mm)
Crystallographic orientations including (110), (112), (211), (510) and any offset to major directions (100) and (111)
Single-Side Polishing (SSP)
Double-Side Polishing (DSP)
Silicon on Insulator
Epitaxial silicon substrates
Small quantity orders are not a problem.
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.