At present, Group III compound semiconductor materials, silicon carbide and oxide semiconductor materials are the mainly third-generation semiconductor materials. Among them, Group III compound semiconductor materials are commonly gallium nitride materials and aluminum nitride materials; oxide semiconductor materials mainly include zinc oxide, gallium oxide [...]
2021-04-06meta-author
PAM XIAMEN offers Photographic Film Letterpress
Accuracy Index
Accuracy/Grade
Accuracy1
Accuracy2
Line Number/Aperture Rate
400dpi/50%
350dpi/50%
Dot arrangement, Dot shape
45°/60°/75°/circle
45°/60°/75°/circle
Dimensional Accuracy
±0.085mm
±0.085mm
Substrate Thickness
1.50mm±0.15mm
1.50mm±0.15mm
Cutting Accuracy
±1mm
±1mm
Main application areas:
LCD-TN/STN/TFT collocated liquid drum glue, namely transfer PI directional liquid to ITO glass. LCD-TN/STN/TFT Photographic Film Letterpress
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at [...]
2019-07-04meta-author
PAM-XIAMEN offers M Plane U-GaN Freestanding GaN Substrate
Item
PAM-FS-GAN M-U
Dimension
5 x 10 mm2 or 5 x 20 mm2
Thickness
380+/-50um
Orientation
M plane (1-100) off angle toward A-axis 0 ±0.5°
M plane (1-100) off angle toward C-axis -1 ±0.2°
Conduction Type
N-type / Undoped
Resistivity (300K)
< 0.1 Ω·cm
TTV
≤ 10 µm
BOW
BOW ≤ 10 µm
Surface Roughness
Front side: Ra<0.2nm, epi-ready;
Back side: Fine Ground or polished.
Dislocation Density
≤5 x 10 6cm-2
Macro Defect Density
0 cm-2
Useable Area
> 90% (edge exclusion)
Package
each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room
For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com
2020-08-17meta-author
We investigated the effects of the substrate off-angle on the m-plane GaN Schottky diodes. GaN epitaxial layers were grown by metal–organic chemical vapor deposition on m-plane GaN substrates having an off-angle of 0.1, 1.1, 1.7, or 5.1° toward . The surface of the GaN epitaxial layers on [...]
2019-12-16meta-author
PAM XIAMEN offers 3″ Diameter Wafer.
3″ Diameter Wafer
Ge Wafer Undoped (100) 3″ dia x 0.5 mm 1 side polished resistivity: >50 ohm-cm
Ge Wafer Undoped (100) 3″ dia x 0.5 mm 2 side polished resistivity: >50 ohm-cm
Ge Wafer Undoped (110) 3″ [...]
2019-04-25meta-author
PAM XIAMEN offers Si+SiO2+Pt Thin Film.
Si+SiO2+Pt Thin Film
SiO2+Pt thin film on Si (B-doped)substrate ,10x10x0.5mm,1sp (SiO2=500nm, Pt=60nm)
Silicon Wafer Specifications:
Conductive type: SiO2+Pt thin film on Si (B-doped, (100)Ori.) substrate ,10x10x0.5mm,1sp( SiO2=500nm,Pt=60nm)
Resistivity: [...]
2019-05-16meta-author