PAM XIAMEN offers 6″CZ Prime Silicon Wafer-2
Si wafers
Orientation (100)
Dia 6” x thickness 500µm
Type n or p
1-20 ohm.cm
One side polished
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Si wafers
Orientation (100)
Dia 6” x thickness 500µm
Type n or p
1-20 ohm.cm
One side polished
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
PAM XIAMEN offers Zero Diffraction Si Wafer Diameter 32mm for XRD measurements Zero Diffraction Plate 32 mm Dia. x Thickness 2.0 mm Si Crystal for XRD sample with below specifications Resistivity>1Ωcm Size: 32 mm diameter x 2.0 mm thickness Surface: double side optical polished Zero diffraction plate is made of [...]
PAM XIAMEN offers test grade silicon wafers Below is just a short list of the test grade silicon substrates! Inches Cust class Dopant Type Orientation PFL length PFL direction SFL Off orientation Resistivity Diameter Thickness Bow TTV Warp 6 SSP Boron P 100 57,5 ± 2,5 110 ± 0,20 0.0 ± 0.2 ° 1 – 10 Ohmcm 150.0 ± 0.2 mm 600 ± 5 µm 3 6 SSP Boron P 111 0,0 ± 0,0 110 ± 1 0.0 ± 0.2° 25 – [...]
PAM XIAMEN offers 3″ Dummy grade silicon wafer Thickness:340-380μm. 3″ Dummy grade / Mechanical Grade silicon wafer, SSP. MUST be Single Side Polished and Single Crystal Silicon. Thickness 340-380μm, no scratch, no films, no etch patterns or residues For more information, please visit our [...]
PAM XIAMEN offers 4″ FZ Prime Silicon Wafer. Silicon wafers, per SEMI Prime, P/P 4″{100.0±0.2}Ø×500±15µm, FZ Intrinsic undoped Si:-[100]±0.5°, Ro > 20,000 Ohmcm, Both-sides-polished, SEMI Flat (one), Sealed in Empak or equivalent cassette. For more information, please visit our website: https://www.powerwaywafer.com, send us email [...]
PAM-XIAMEN offers A Plane N-GaN Freestanding GaN Substrate Item PAM-FS-GAN A-N Dimension 5 x 10 mm2 or 5 x 20 mm2 Thickness 380+/-50um Orientation A plane (11-20) off angle toward M-axis 0 ±0.5° A plane (11-20) off angle toward C-axis -1 ±0.2° Conduction Type N-type / Si Doped Resistivity (300K) < 0.05 Ω·cm TTV ≤ 10 µm BOW -10 µm ≤ BOW ≤ 10 µm Surface Roughness: Front side: Ra<0.2nm, epi-ready; Back side: Fine Ground or polished. Dislocation Density ≤ 5 x 106 cm-2 Macro Defect Density 0 cm-2 Useable Area > 90% (edge exclusion) Package each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com
PAM XIAMEN offers Silicon wafers. We are often asked how many silicon wafers are produced annually. The answer depends on a more specific question including: What Diameter What Country or Entire World Semiconductor or Solar industries or both Monitor Grade, Test Grade, Prime Grade Above are just some terms that need [...]
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