Diamond Heat Sink

Diamond Heat Sink

PAM-XIAMEN can offer the diamond heat sink. Due to its high thermal conductivity of 1500 W/m·K, diamond is a good choice as a microchannel heat sink material. The diamond heat sink compound can withstand a high-density heat load up to 267W/cm2, achieving high cooling performance and extending the life of electronic devices. The specifications we offer are as follows:

Diamond heat sink

Diamond heat sink

1. Specifications of Diamond Heat Sink

Product Diamond Heat Sink
Growth Method MPVCD
Thermal Expansion Coefficient 1.3(10-6K-1)
Thermal Conductivity TDTR Detection Method 1500±200W/m.K
Size 1*1 cm, 2*2 cm, custom sizes
Thickness Can Be Customized Diamond 0~500μm
Thickness Tolerance ±20μm
Growth Surface Roughness < 30 nm Ra
FWHM(D111) 0.446

2. What Is Diamond Heat Sink?

The diamond heat sink is a material used as an electronic heat sink. There are 3 types of the diamond heat sink:

* In electronic packaging, the diamond heat sinks refer to a miniature heat sink, a device used to cool electronic chips;

* In aerospace engineering, it refers to a device that uses black paint on the inner surface of liquid nitrogen siding to simulate the cold dark environment of the universe;

* In terms of the LED lighting package, because high heat is generated when the LED emits light, a copper column with high thermal conductivity is used to guide the heat to the outside of the package. This LED copper pillar is also called a heat sink. LD (Laser Diode) also generates more heat. Thereby, it needs to be mounted on a CVD diamond heat sink to help dissipate heat and stabilize the operating temperature.

3. How to Detect the Thermal Conductivity of Polycrystalline Diamond Heat Sink?

For synthetic diamond heat sink testing, the more scientific and accurate TDTR method is usually adopted internationally. TDTR(time domain thermal reflectance) detection system is used to measure the cross-sectional thermal conductivity of the diamond sample. TDTR is a more precisely optical pump detection method. This method can be used to describe the characteristics of heat transfer of various materials, including bulk, thin films and even liquids.

Before measuring, the sensing layer is deposited on the diamond sample by magnetron sputtering. The optical reflectance of the aluminum layer responds with the temperature linear. From this, the thermal transfer characteristics can be evaluated based on the temperature attenuation of the sample heated. During the test, laser pulses are generated, and then the laser beam is divided into a pump beam and a probe beam. As a heat source, the pump beam is used to heat the sample, and then using the probe beam to detect temperature changes. A time delay between the pump and probe pulses is created by the delay phase. Silicon photodetector is used to determine the reflexted probe beam, and RF lock-in amplifier extracts the output signals.Collecting and analyzing the in-phase (Vin) and out-of-phase (Vout) signals, use the diffusive heat transfer model depended on the Vin/Vout of the delay time to obtain the thermal transfer features of the heat sink in diamond.

powerwaywafer

For more information, please contact us email at [email protected] and [email protected].

Share this post