Diamond substrate

Diamond substrate

We offers  Diamond wafer substrate(PAM-190906-Diamond) at below spec:
Diamond substrate
Size: option1: 2×2.5 mm; Option2: 4×4.5 mm
Thickness: 0.15+/-0.05mm
backside polished, Ra<0.03nm,
front side lapping, Ra<0.25um
Single peak level <= 5nm
thermal conductivity: 1800w/m.k;
Application: substrates will be mounted under chip crystals as temperature compensators

How is the surface treated of CVD diamond substrate?

It depends on the application, usually for the heat sink, it is treated in this way: Bottom surface polishing, growth surface grinding

For more information, send us email at victorchan@powerwaywafer.com

Share this post