Thermal Grade Diamand Wafers and Slices
Diamond exhibits the highest thermal conductivity among all materials. Its thermal conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore diamond wafers and slices become more and more popular in thermal management as heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation between top and bottom metallization, stress relieving slits for stress free mounting etc.
CVD diamond heat spreaders in various shapes,and the typical parameters are as follows:
|Diameter||80mm, or small size such as 5*5mm2|
|Process||DC Arc Plasma|
|Chemical composition||100% C|
|Young’s modulus||1000-1100 Gpa|
|Thermal conductivity||C>1,000 W/m.K, B>1300W/m.K,A>1800W/m.K|
|Tensile strength||>350 kg/mm²|
|Vickers Hardness||7000~10000 kg/mm²|
|Wear resistance(abrasion ratio)||100,000~200,000|
|Chemical Stability||Insoluble in alkali and acid|
|Surface finish polished||＜50 nm|
|Surface finish lapped||＜0.5 um|
Optical grade diamond wafers
Optical grade diamond wafers are used as window for infrared beam splitters, lenses for terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.