Diamond wafers

There are three grade diamond wafer, Microelectronics Grade Diamond Wafer for wafer fabrication, Thermal Grade Diamand Wafers and Slices and Optical grade diamond wafers:

1.Microelectronics Grade Diamond Wafer for wafer fabrication

1.1 specification of Microelectronics Grade Diamond Wafer

Diamond Wafer Polycrystalline Diamond
Growth Method MPCVD
Wafer Thickness 0~500um+/-25um
Wafer Size 1cm*1cm;2inch; custom
Surface Roughness Ra< 1 nm
FWHM (D111) 0.354
Coefficient of Thermal Expansion  1.3×10^-6 K^-1
Thermal conductivity >1000 W/m.K
 

Microelectronics Grade Diamond Wafer

 
 

 1.2 Manufacturing flow of Microelectronics Grade Diamond Wafer

Microelectronics Grade Diamond Wafer

 

 

 

 

 

1.3 XRD spectra of 2inch CVD diamond Wafer.

The primary crystal facets orientation of CVD diamond films is (111) plane.

CVD diamond films is (111)

 

 

 

 

 

 

 

1.4  Raman spectra of 2inch CVD diamond Wafer.

There is only one single diamondpeak at 1333.48 cm-1.

diamond wafer

 

 

 

 

 

 

 

 

1.5 SEM micrographs( × 1k) of the 2-inch diamond Wafer after roughpolishing .

diamond Wafer

 

 

 

 

 

 

 

 

1.6 AFM micrographs of the 2-inch diamond wafer after rough polishing.

Image Ra = 137 nm with the scanning area of 5×5 μm2.

diamond wafer

 

 

 

 

 

 

 

1.7 SEM micrographs(× 1k) of the 2-inch diamond wafer after finishing polishing.

diamond wafer

 

 

 

 

 

 

 

 

1.8 AFM micrographs of the 2-inch diamond wafer after finishing polishing.

Image Ra = 0.278 nm with the scanning area of5×5 μm2.

diamond wafer

 

 

 

 

 

 

 

 

Image Ra = 0.466 nm with the scanning area of 15×15 μm2.

diamond wafer

 

 

 

 

 

 

 

1.9 EDS results for polished films.

The content of elements on the polished area is all carbon. No metal contaminationfrom the polishing plate.

Diamand Wafers

 

 

 

 

 

 

1.10 XPS results for polished films.

Diamand Wafers

 

 

 

 

 

 

 

 

2.Thermal Grade Diamand Wafers and Slices

Diamond exhibits the highest thermal conductivity among all materials. Its thermal conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore diamond wafers and slices become more and more popular in thermal management as heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation between top and bottom metallization, stress relieving slits for stress free mounting etc.

CVD diamond heat spreaders in various shapes,and the typical parameters are as follows:

Item Value
Diameter 80mm, or small size such as 5*5mm2
Available Thickness 0.3mm
Thickness tolerance /-0.02mm
Process DC Arc Plasma
Structure Polycrystalline
Chemical composition 100% C
Density 3.52 g/cm³
Poisson’s ratio 0.1
Young’s modulus 1000-1100 Gpa
Thermal conductivity C>1,000 W/m.K, B>1300W/m.K,A>1800W/m.K
Tensile strength >350 kg/mm²
Vickers Hardness 7000~10000 kg/mm²
Compressive strength 110GPa
Thermal stability 800
Wear resistance(abrasion ratio) 100,000~200,000
Chemical Stability Insoluble in alkali and acid
Surface finish polished 50 nm
Surface finish lapped 0.5 um

3.Optical grade diamond wafers

Optical grade diamond wafers are used as window for infrared beam splitters, lenses for terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.

Source:PAM-XIAMEN

powerwaywafer

 

 

 

 

 

For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com

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