Diamond wafers

Diamond wafers

Thermal Grade Diamand Wafers and Slices

Diamond exhibits the highest thermal conductivity among all materials. Its thermal conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore diamond wafers and slices become more and more popular in thermal management as heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation between top and bottom metallization, stress relieving slits for stress free mounting etc.

CVD diamond heat spreaders in various shapes,and the typical parameters are as follows:

Item Value
Diameter 80mm, or small size such as 5*5mm2
Available Thickness 0.3mm
Thickness tolerance /-0.02mm
Process DC Arc Plasma
Structure Polycrystalline
Chemical composition 100% C
Density 3.52 g/cm³
Poisson’s ratio 0.1
Young’s modulus 1000-1100 Gpa
Thermal conductivity C>1,000 W/m.K, B>1300W/m.K,A>1800W/m.K
Tensile strength >350 kg/mm²
Vickers Hardness 7000~10000 kg/mm²
Compressive strength 110GPa
Thermal stability 800
Wear resistance(abrasion ratio) 100,000~200,000
Chemical Stability Insoluble in alkali and acid
Surface finish polished 50 nm
Surface finish lapped 0.5 um

 

Optical grade diamond wafers

Optical grade diamond wafers are used as window for infrared beam splitters, lenses for terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.

Source:PAM-XIAMEN

For more information, please visit our website:https://www.powerwaywafer.com, send us email at sales@powerwaywafer.com  or powerwaymaterial@gmail.com.

Diamond substrate

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