PAM XIAMEN offers Diced Silicon Wafers.Wafer thickness could be customized.
PAM XIAMEN and our partners provide researchers with creative silicon wafer and other substrate dicing solutions. Using precision diamond saws we can cut a variety of hard brittle materials.
Our Services Include.
Small quantity wafer dicing at an affordable price. Larger volumes are available on request.
Dicing Strengths Include:
Make cuts as small as 25 microns wide
Perform trenching with variations in depth to < 5 microns over a 4″ cut
Process wafers as thin as 50 microns
Cut wafers as thick as 10 mm
Handle wafers as large as 300 mm
Place cuts inside of cuts to create a custom trench profile
Make standard entry cuts and plunge cuts
Ship in waffle packs, gel packs and on tape & ring
Below are just a few dicing applications that clients have used us for.
Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.
Micromachining of various sizes of Nitinol springs and tubes.
Cutting of 750 micron diameter glass and ceramic tubes.
Cutting of custom sized microscope slides with delicate surface processing.
Sawing of 1/4″ thick quartz photomask.
Sawing Silicon/Pyrex material with a special blade to provide an 8 degree sidewall.
Providing “near Polished” cuts to eliminate a polishing step for the end customer.
Delivering cut silicon pieces on non-tack tape to facilitate an automatic pick and place process.
Dicing of wafers with very fragile bumps.
Cutting and picking of die pieces from a 50 micron thick wafer.
Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).
Precision routing of very small printed circuit boards from panels.
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
You can get our free technology service from enquiry to after service based on our 25+ experiences in semiconductor line.