Etching Wafer

Etching Wafer

The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, to reduce the costs. There are the low-roughness, low-reflectivity and high-reflectivity etching wafers.

  • Description

Product Description

Etching wafer

The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, to reduce the costs. There are the low-roughness, low-reflectivity and high-reflectivity etching wafers.

Our advantages at a glance

1.Advanced epitaxy growth equipment and test equipment.

2.Offer the highest quality with low defect density and good surface roughness.

3.Strong research team support and technology support for our customers

FZ etching wafers Specifications

Type Conduction type Orientation Diameter scope(mm) Resistivity scope(Ω cm) Geometric parameter,graininess,surface metal
FZ N&P <100>&<111> 76.2-200 >1000 T≥180(um)TTV≤2(um)TIR≤2(um)the maximum reflectivity could be 90%
NTDFZ N <100>&<111> 76.2-200 30-800
CFZ N&P <100>&<111> 76.2-200 1-50
GDFZ N&P <100>&<111> 76.2-200 0.001-300

CZ etching wafers Specifications

Type Conduction type Orientation Diameter scope(mm) Resistivity scope(Ω cm) Geometric parameter,graininess,surface metal
MCZ N&P <100> <110>&<111> 76.2-200 1-300 T≥180(um)TTV≤2(um)TIR≤2(um)the maximum reflectivity could be 90%
CZ N&P <100> <110>&<111> 76.2-200 1-300
MCZ heavily doped N&P <100> <110>&<111> 76.2-200 0.001-1