PAM-XIAMEN is able to supply you with P type SiC substrate, more specifications please see: https://www.powerwaywafer.com/p-type-silicon-carbide-substrate-and-igbt-devices.html.
SiC single crystal has the characteristics of wide bandgap, high critical breakdown electric field, high thermal conductivity, high carrier saturation drift speed, and good stability. Among the numerous crystal [...]
2024-04-19meta-author
PAM XIAMEN offers ITO coated(sodalime) glass.
ITO Physical properties
Melting point
1800–2200 K (1526-1926 °C) (2800–3500 °F)
Density
7120–7160 kg/m3 at 293 K
Color (in powder form)
Pale yellow to greenish yellow, depending on SnO2 concentration
Values vary with composition. SI units and STP are used except where noted.
ITO Coated Glass, 10mmx10mmx 0.7mm
ITO Coated Glass Substrate 10mm x 10 mm x [...]
2019-04-28meta-author
PAM XIAMEN offers LiAlO2 Lithium Aluminate Crystal Substrates.
Main Parameters
Crystal structure
M4
Unit cell constant
a=5.17 A c=6.26 A
Melt point(℃)
1900
Density
2.62(g/cm3)
Hardness
7.5(mohs)
Size
10×3,10×5,10×10,15×15,20×15,20×20,
Ф15,Ф20,Ф1″,Ф2″, Ф2.6″
Thickness
0.5mm, 1.0mm
Polishing
Single or double side polished
Crystal [...]
2019-03-13meta-author
PAM XIAMEN offers MoSe2 crystal.
MoSe2 is a layered material with strong in-plane bonding and weak out-of-plane interactions. These interactions lead to exfoliation into two-dimensional layers of single unit cell thickness. In addition, MoSe2 have sizable bandgaps that change from indirect to direct in [...]
2019-05-13meta-author
PAM XIAMEN offers4″ FZ Prime Silicon Wafer-8
4″ GDFZ Si wafer
N type, As doped
Orientation (100)
Thickness 250±25μm,
Resistivity 0.001-0.005Ωcm
DSP
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the first generation Germanium wafer, second generation Gallium Arsenide with [...]
2019-10-25meta-author
Etching is a technique used for micromachining to chemically remove layers from the surface of a wafer during manufacturing. Etching techniques can be divided into wet etching and dry etching. PAM-XIAMEN can provide silicon etching wafer for your applications.
1. Wet Chemical Etching
The mechanism of [...]
2022-05-30meta-author