Getting to 450 mm Wafer Soone

Getting to 450 mm Wafer Soone

Getting to 450 mm Wafer Sooner

 

As device circuits continue to get smaller, the wafers that they are made from are getting larger — again. A few years ago device manufacturers — both vertically integrated companies and independent foundries — pushed maximum wafer diameters from 200 mm to 300 mm. The next step will see 450 mm wafers in production around 2018. The ramp-up road will prove bumpy, however, for economic as well as technical reasons. Now one company has delivered lithography-imprint equipment to an unnamedsemiconductor manufacturer to help smooth the path to the larger wafers. The equipment vendor predicts that the machine will shave two years off the development time.

SOURCE:IHS
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2013-03-14

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