We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.
1.Specification of Glass Wafer
|Diameter||2″, 4″, 6″, 8″, 10″|
|Thickness||0.12mm, 0.13mm, 0.2mm, 0.25mm, 0.45mm|
|Thickness Variation (TTV)||< 0.01mm|
|Surface Roughness (RMS)||<1.5nm|
|Scratch and Dig||May 2nd|
|For the customized dimension, please contact us|
2.Glass Wafer Process
Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn
Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.
Wafer Lapping: the wafer is lapped to appointed thickness.
Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.
Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.
Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.
Wafer Packaging: All wafers are packed in the single wafer containers.
3. Transmittance of Glass Wafer