Glass Wafer

Glass Wafer

We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.

1. Specification of Glass Wafer

Parameter Measurement
Diameter 2″, 4″, 6″, 8″, 10″
Dimensional Tolerance ±0.02μm
Thickness 0.12mm, 0.13mm, 0.2mm, 0.25mm, 0.45mm
Thickness Tolerance ±10μm
Thickness Variation (TTV) < 0.01mm
Flatness 1/10 Wave/Inch
Surface Roughness (RMS) <1.5nm
Scratch and Dig May 2nd
Particle Size <5μm
Bow/Warp <10μm
For the customized dimension, please contact us

 

2. Glass Wafer Process

Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn

Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.

Wafer Lapping: the wafer is lapped to appointed thickness.

Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.

Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.

Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.

Wafer Packaging: All wafers are packed in the single wafer containers.

Transmittance of Glass Wafer

3. Transmittance of Glass Wafer

Glass Wafer

Glass Wafer

Glass Wafer

Transmittance of Glass Wafer

4. Scratch/Dig Inspection Standard for Glass Wafer

We inspect the glasses for scratches by strong light (Multi-angle parallel light source) in a dark room.

Inspection Purpose: To determine whether there are fine scratches, foreign bodies, microbubbles on the glass surface.

Inspection Content: Inspect for fine scratch on glass surface 

Reference Light Source: Multi-angle parallel light source

Analysis: The inspection for fine scratch, foreign matter on glass surface.

The glass is a highly reflective object, and the multi-angle parallel light source can illuminate the fine scratches clearly, and very uniform.

Scratch/Dig: 60/40 means:

60: max allowable scratch width (0.06mm width)

40: max allowable dig diameter (0.4mm diameter)

More about the scratch or dig number, please refer to the table below:

Scratch  Number Maximum Allowable
Scratch Width
(mm)		 　 Dig Number Maximum Allowable
Dig or Bubble Diameter
(mm)
120 0.12 120 1.2
80 0.08 80 0.8
60 0.06 60 0.6
50 0.05 50 0.5
40 0.04 40 0.4
30 0.03 30 0.3
20 0.02 20 0.2
Purpose:
glass surface quality on optical components

Definitions:
Scratch: Any marking or tearing of the glass surface.
Dig: A small rough spot on the glass surface similar to pits in appearance.
       A bubble is considered as a dig.

Procedure:
Surface quality is to be specified by a number such as 60/40. The Column 2nd relates to the maximum width allowance of a scratch as measured in microns. The Column 4th indicates to maximum diameter allowance for a dig in hundredths of a millimeter. Thus, as can be seen from the table below, a surface quality callout of 60/40 would permit a scratch width of 0.06mm and a dig diameter of 0.4mm. The size of a defect is to be measured through the use of an optical comparator.

 

For more information, please contact us email at [email protected] and [email protected].

2018-07-11

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