1 – Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology
This chapter reviews various processes for manufacturing SOI wafers. There is a specific focus on Separation by IMplantation of OXygen (SIMOX) and on technologies based on direct bonding (bonded silicon-on-insulator (BSOI), epitaxial layer transfer process (Eltran®), Smart Cut™). For the latter, the physical and chemical properties of both starting wafers and SOI structures are mainly discussed. These analyses help in developing models for direct bonding and splitting. Recent fabrication process improvements and trends towards innovative engineered structures are also described.