PAM XIAMEN offers 6″ FZ Silicon Wafer
Silicon wafers, per SEMI Prime, P/E 6″Ø×875±25µm,
FZ p-type Si:B[111]±0.5°, Ro > 10,000 Ohmcm,
Warp<60μm,
One-side-polished, Particles: ≤10@≥0.3μm,
MCL (Na, Al, K, Fe, Ni, Cu, Zn)<5E10/cm²,back-side etched,
Tarnish, orange peel, contamination, haze,
micro scratch, chips, edge chips, crack,
crow feet, pin hole, pits, dent, waviness,
smudge&scar on [...]
2019-09-03meta-author
HgCdTe thin films have been deposited on CdZnTe/Si(1 1 1) substrates by pulsed laser deposition (PLD). A Nd:YAG pulsed laser with a wavelength of 1064 nm was used as laser source. The effects of CdZnTe buffer layer thickness which varied with the deposition time in the range from [...]
InGaAs HEMTs form two-stage gain blocks delivering 9 dB of gain while consuming just 20 mW
A TEAM of Taiwanese engineers has used flip-chip packaging to build anInGaAs HEMT delivering up to 6.5 dB of gain at 60 GHz.
The researchers argue that one of the [...]
2012-09-10meta-author
PAM-XIAMEN can offer 2” InGaAs/InP epi wafer for PIN as follows. InGaAs is the compound of InAs and GaAs. In the periodic table of chemical elements, In and Ga are elements of the third group, and As is the fifth group element. The properties of InGaAs [...]
PAM XIAMEN offers high-quality Al2O3 (Sapphire).
M-Plane (1-100)
Al2O3 – Sapphire Wafer, M plane, 5x5x0.5mm, 2 SP – ALM050505S2
Al2O3 – Sapphire Wafer, M plane, 5x5x0.5mm,1 SP – ALM050505S1
Al2O3 – Sapphire Wafer, M plane, <10-10> 10x10x0.5mm, 2SP – ALM101005S2″
Al2O3 – Sapphire Wafer, [...]
2019-04-16meta-author
GaN epitaxy template on Sapphire substrate with N-type, P-type or semi-insulating is available for the preparation of semiconductor optoelectronic devices and electronic devices. GaN epitaxial layer on sapphire substrate refers to a composite structure composed of a gallium nitride single crystal thin film material [...]
2019-04-22meta-author