3″ Silicon Wafer-4

3″ Silicon Wafer-4

PAM XIAMEN offers 3″ Silicon Wafer.

Material Orient. Diam. Thck
(μm)
Surf. Resistivity
Ωcm
Comment
p-type Si:B [110] ±0.5° 3″ 381 P/E 0.085-0.115 SEMI Prime, Primary Flat @ [111]±0.5°, Secondary @ [111] 109.5° CW from Primary, in Epak cassettes of 6, 7 & 7 wafers
p-type Si:B [110] ±0.3° 3″ 381 P/E 0.0448-0.0672 SEMI Prime, Primary @ [111], Secondary @ [111] 109.5±2° CW from Primary, hard cst
p-type Si:B [110] ±0.3° 3″ 381 P/E 0.0448-0.0672 SEMI Prime, Primary @ [111], Secondary @ [111] 109.5±2° CW from Primary, in hard cassettes of 5 wafers
p-type Si:B [110] ±0.5° 3″ 381 P/E 0.003-0.005 SEMI Primet, Primary Flat @ [111]±0.5°, Secondary Flat @ [111] (109.5±2° CW from Primary)
p-type Si:B [100] 3″ 380 P/E 10-20 SEMI Prime
p-type Si:B [100] 3″ 500 P/E 10-20 SEMI Prime
p-type Si:B [100] 3″ 380 P/E 5-10 SEMI Prime, TTV<5μm
p-type Si:B [100] 3″ 380 P/E 5-10 SEMI Prime, TTV<5μm
p-type Si:B [100] 3″ 380 P/E 5-10 SEMI, TTV<5μm
p-type Si:B [100] 3″ 250 P/P 1-20 SEMI Primet, TTV<5μm
p-type Si:B [100] 3″ 375 P/E 1-100 {1.6-5.5} SEMI Prime, TTV<4μm, Empak cst, Front-side Prime, Back-side polished but not prime.
p-type Si:B [100] 3″ 380 P/P 1-10 SEMI Prime
p-type Si:B [100] 3″ 380 P/P 1-10 SEMI Prime, TTV<5μm
p-type Si:B [100] 3″ 380 P/E 1-10 SEMI Prime
p-type Si:B [100] ±1° 3″ 381 P/P 1-10 SEMI Prime, TTV<1μm, Empak cst
p-type Si:B [100-6° towards[110]] ±0.5° 3″ 381 P/E 1-10 SEMI Prime
p-type Si:B [100] 3″ 500 P/E 1-10 SEMI Prime
p-type Si:B [100] 3″ 725 C/C 1-100 SEMI Prime, TTV<1μm
p-type Si:B [100] ±1.0° 70mm×120mm 1200 P/E 1-30, 70mm×120mm rectangles
p-type Si:B [100] 3″ 1500 P/P 1-20 Prime, Individual cst
p-type Si:B [100] 3″ 5000 P/E 1-20 {6-8} SEMI Prime, Individual cst

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

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