PAM XIAMEN offers Aluminium Crystal & Substrates (single crystal).
Aluminium Single Crystal Boule Grown by Bridgemen method.
Aluminum Single Crystal Substrate: <100>, 2″ Dia. x1.0 mm, 1 side polished
Aluminum Single Crystal Substrate: <100>, 10x10x0.5 mm, 1 side polished
Aluminum Single Crystal Substrate: <100>, [...]
2019-05-08メタ著者
Helium implantation-induced layer splitting of InP in combination with direct wafer bonding was utilized to achieve low temperature layer transfer of InP onto Si(1 0 0) substrates. InP(1 0 0) wafers with 4 inch diameter were implanted by 100 keV helium ions with a dose of 5 × 1016 cm−2. Then [...]
2019-12-09メタ著者
Effect of annealing on the residual stress and strain distribution in CdZnTe wafers
The effect of annealing on residual stress and strain distribution in CdZnTe wafers was studied based using an X-ray diffraction (XRD) method. The results proved the effectiveness of annealing on the reduction [...]
Analyses of Five Major LED Manufacturers Vertical Integration Strategies (Part 1)
Upheld as the classical business models in the LED industry, Dutch lighting giant Philips and leading German lighting manufacturer Osram business models have been the most discussed among market insiders. The two European companies vertical integration [...]
2016-05-04メタ著者
SiC devices are made from silicon carbide(SiC) wafers. So, here comes a question: how to obtain a silicon carbide wafer? Generally, a SiC wafer is cut from cylindrical SiC boules. As for the cutting process, methods for cutting silicon carbide ingots are introduced here.
A diamond [...]
2021-04-27メタ著者
AMCA-01 is an analog multi-channel equipment which used for energy spectrum analyze for variety of radiations detectors. Added with upper computer software, it can collect analog energy spectral signal, drawing energy spectrum and analyzing it, and counting full energy peak resolution. The software also [...]
2019-04-25メタ著者