76.2mm (3 Inch) Silicon Wafers

76.2mm (3 Inch) Silicon Wafers

PAM XIAMEN offers 1″Si wafers. Please send us email at sales@powerwaywafer.com if you need other specs and quantity.

Item Dia Type Dopant Orien Res (Ohm-cm) Thick (um) Polish Description
PAM2266 25.4mm P B <111> >1000 20000um DSP FZ
PAM2267 25.4mm P B <100> ANY 400um SSP Thickness is: 400+/-100um.
PAM2268 25.4mm ANY <100> 500um SSP Wafers have particles. Wafers sold “As-Is”.
PAM2269 25.4mm Undoped Undoped <111> >2000 280um SSP Intrinsic FZ
PAM2270 25.4mm Undoped Undoped <100> >5000 73.5um DSP FZ, Float Zone
PAM2271 25.4mm P B <100> .01-.05 500um DSP NO flats, COMPLETELY round. Minimum Order Quantity 5 wafers.

 

Item Material Orient. Diam
(mm)
Thck
(μm)
Surf. Resistivity
Ωcm
Comment
PAM2271 p-type Si:B [100] 1″ 280um P/E 0-100 ohm-cm SEMI, 1Flat, Soft cst
PAM2272 Intrinsic Si:- [111] 1″ 280um P/E FZ >2000 ohm-cm Test Grade
PAM2273 p-type Si:B [100] 1″ P/E ANY Test Grade
PAM2274 n-type Si:P [100] 1″ 475 ±10 E/E FZ >500 {1,900–2,400} NO Flats, Soft cst
PAM2275 n-type Si:P [111] ±0.5° 1″ 280 P/P FZ 2,000–10,000 NO Flats, TTV<5μm, Soft cst
PAM2276 Intrinsic Si:- [100] 1″ 500 P/E FZ >20,000 SEMI Prime, 1Flat, hard cst
PAM2277 Intrinsic Si:- [100] 1″ 160 P/P FZ >10,000 Prime, NO Flats, hard cst, TTV<8μm
PAM2278 Intrinsic Si:- [100] 1″ 160 P/P FZ >10,000 Prime, NO Flats, hard cst, TTV<8μm
PAM2279 Intrinsic Si:- [111] ±0.5° 1″ 500 P/P FZ >17,500 SEMI Prime, 1Flat, hard cst
PAM2280 Intrinsic Si:- [111] ±0.5° 1″ 500 P/P FZ >15,000 SEMI Prime, 1Flat, hard cst
PAM2281 Intrinsic Si:- [111] ±0.5° 1″ 1000 P/E FZ 14,000–30,000 NO Flats, Soft cst, Cassettes of 7, 6, 6 wafers
PAM2282 Intrinsic Si:- [111] ±2° 1″ 27870 C/C FZ >10,000 Single Crystal Silicon Rod, 0.39″ diameter × 27.87±0.1mm
PAM2283 p-type Si:B [510] 1″ 1000 P/E 1–100 {7.4–7.4} NO Flats, Soft cst
PAM2284 p-type Si:B [100] 1″ 100 ±15 P/P 1–10 Prime, NO Flats, in sealed bags of 5 wafers.
PAM2285 p-type Si:B [100] 24mm 300 P/E 1–100 Prime, NO Flats, hard cst
PAM2286 p-type Si:B [100] 24.3mm 300 P/E 1–10 Prime, NO Flats, hard cst
PAM2287 p-type Si:B [100] 1″ 300 P/E 1–10 {2.8–2.9} SEMI Prime, 1Flat, Soft cst
PAM2288 p-type Si:B [100] 1″ 300 P/E 1–10 Prime, NO Flats, Soft cst
PAM2289 p-type Si:B [100] 24.3mm 300 P/E 1–10 {1.5–1.7} Prime, NO Flats, hard cst
PAM2290 p-type Si:B [100] 1″ 525 ±10 P/E 1–30 Prime, NO Flats, Soft cst, TTV<5μm, Cassettes of 20 and 8 wafers
PAM2291 p-type Si:B [100] 1″ 1000 P/E 1–30 SEMI Prime, 1Flat, hard cst
PAM2292 p-type Si:B [100] 1″ 3000 P/E 1–50 Prime, NO Flats, Individual cst, Group of 13 wafers
PAM2293 p-type Si:B [100] 1″ 275 P/P 0.015–0.020 SEMI Prime, 1Flat, hard cst
PAM2294 p-type Si:B [100] 1″ 275 P/E 0.015–0.020 SEMI Prime, 1Flat, Soft cst
PAM2295 p-type Si:B [111] ±0.5° 1″ 50 ±10 P/P 1–100 NO Flats, Soft cst
PAM2296 n-type Si:P [100] 1″ 50 ±10 P/P >20 SEMI Prime, 1Flat, TTV<5μm, in single wafer trays between clean–room sheets, MOQ 4 wafers
PAM2297 n-type Si:P [100] 1″ 280 P/E 1–5 SEMI, 1Flat, hard cst
PAM2298 n-type Si:P [100] 1″ 1500 P/E 1–20 Prime, NO Flats, Soft cst
PAM2299 n-type Si:P [111] 1″ 330 P/E FZ >90 Prime, NO Flats, hard cst
PAM2300 p-type Si:B [100] 1″ 775 P/E 8–12 SEMI Prime, 1Flat, Soft cst
PAM2301 p-type Si:B [100] 1″ 300 P/P 4–6 SEMI Prime, 1Flat, hard cst
PAM2302 p-type Si:B [100] 24mm 300 P/E 1–100 Prime, NO Flats, Soft cst
PAM2303 p-type Si:B [100] 1″ 300 P/E 1–10 Prime, NO Flats, Soft cst
PAM2304 p-type Si:B [100] 1″ 500 P/E 1–10 Ile zostalo ?
PAM2305 p-type Si:B [100] 1″ 380 P/E 0.003–0.005 SEMI Prime, 1Flat, hard cst
PAM2306 p-type Si:B [100] 1″ 275 P/E 0.002–0.005 Prime, NO Flats, hard cst
PAM2307 n-type Si:P [100] 1″ 50 ±10 P/P >20 SEMI Prime, 1Flat, TTV<5μm, in single wafer trays between clean–room sheets, MOQ 5 wafers
PAM2308 n-type Si:P [100] 1″ 3500 P/E 1.2–3.0 SEMI Prime, 2Flats, Individual cst
PAM2309 n-type Si:P [100] 1″ 300 P/E 1–20 SEMI Prime, 1Flat, hard cst
PAM2310 n-type Si:As [100] 1″ 300 P/P 0.001–0.005 Prime, NO Flats, hard cst
PAM2311 n-type Si:As [111] 1″ 380 P/E 0.002–0.007 SEMI Prime, 1Flat, hard cst

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.

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