2.炭化ケイ素ウェーハの寸法特性、用語および方法の定義

2-31.N型

2-31.N type A semiconductor has electrical conductivity between that of a conductor and an insulator. Semiconductors differ from metals in their characteristic property of decreasing electrical resistivity with increasing temperature.Semiconductors can also display properties of passing current more easily in one direction than the other, and sensitivity to light. Because [...]

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2-32.半絶縁

2-32.Semi-insulating Semi-insulating Doping with the impurities vanadium creates semi-insulating material of silicon carbide.

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2-33.P型

2-33.P type A semiconductor has electrical conductivity between that of a conductor and an insulator. Semiconductors differ from metals in their characteristic property of decreasing electrical resistivity with increasing temperature.Semiconductors can also display properties of passing current more easily in one direction than the other, and sensitivity to light. Because [...]

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2-34.化学機械研磨

2-34.Chemical Mechanical Polishing Chemical Mechanical Polishing/Planarization is short as CMP, a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.

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2-35.プライムグレード

2-35.Prime Grade Prime Grade:The highest grade of a silicon carbide wafer.  SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Prime Wafers”.

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2-37.テストグレード

2-37.Test Grade Test Grade: A silicon carbide wafer of lower quality than Prime, and used primarily for testing processes.  SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Test Wafers”.

2018-06-28 続きを読む...