ニュース

6インチのドープされていないGaAs基板、プライムおよびメカニカルグレード

PAM-XIAMEN supplies 6 inch undoped GaAs substrates, which are prime grade and mechanical grade grown by VGF. For wafer details, please view specifications listed below: 1. Prime Grade Undoped GaAs PAM220704-GaAs-Un Parameter GaAs-Un-6in-625um-PP UOM Growth method VGF 　 Grade Prime grade (Epi-ready) 　 Dopant Undoped   Orientation (100) ±0.5°   Orientation Angle N/A ° Diameter 150.0±0.2 mm Thickness 625±25 or 675±25 um Notch [010] ± 2°   Notch Depth 1.00-1.25 mm Notch Angle 89-95 ° CC N/A /cm3 [email protected] 22°C ≥1E8 ohm·cm Mobility [...]

2022-07-04 続きを読む...

シリコンウェーハの等方性エッチングと異方性エッチング

PAM-XIAMEN can provide etching silicon wafer in P type and N type, more specifications please see: https://www.powerwaywafer.com/silicon-wafer/etching-wafer.html. The etching of silicon wafers is divided into isotropy and anisotropy, shown as Fig. 1. Isotropy etching means that the etching rate of silicon in all directions is the same during the etching process, and the etching result is [...]

2022-07-01 続きを読む...

シリコン単結晶の炭素と酸素の含有量を決定する方法は？

In the production process of single crystal silicon, impurities such as carbon and oxygen are inevitably introduced due to factors such as raw materials and methods, which directly affect the performance of single crystal silicon. For example, the annealed silicon wafer supplied by us, shown as Fig.1, more details [...]

2022-06-29 続きを読む...

シリコン（Si）ウェーハを洗浄する方法は？

As the basis for making photovoltaic cells and integrated circuits, silicon wafer cleaning is very important. The effect of cleaning directly affects the final performance, efficiency and stability of photovoltaic cells and integrated circuits. Cleaning the silicon wafer not only removes impurities on the surface of the silicon wafer [...]

2022-06-24 続きを読む...

なぜシリコンウェーハがチップを作るのに最も適した材料なのですか？

When it comes to choosing a material as the basic material for transistors in computers, the key matter we need to consider is resistance. Conductors have very low resistance and can conduct electricity easily; insulators have high resistance and cannot conduct electricity. For transistors, it is necessary to be [...]

2022-06-21 続きを読む...

内因性および外因性半導体についての何か

There are three basic types of semiconductor materials: intrinsic semiconductors, extrinsic semiconductors, also known as impurity semiconductors. Both types of semiconductor materials can be supplied by PAM-XIAMEN. 1. What Is Intrinsic Semiconductor? Intrinsic semiconductor refers to a pure semiconductor that is completely free of impurities and lattice defects, and generally such [...]

2022-06-20 続きを読む...

Silicon Vacancy (Vsi) — Spin Color Center in Silicon Carbide

Solid-state spin color center is an important research platform for quantum information processing, and diamond nitrogen vacancy (NV) color center is its outstanding representative. Since the detection of a single diamond NV color center at room temperature was reported by a German research team in 1997, important progress has [...]

2022-06-14 続きを読む...

Nanoscale Depth Control of Implanted Shallow Silicon Vacancies in Silicon Carbide

We are an expert of semiconductor wafers in semiconductor industry, and we offer technology support and wafers selling for thousands of univerisities and industrial customers by our decades experience, including Cornell University, Stanford Univeristy, Peking University, Shandong Univerity, university of south carolina, Caltech Faraon lab (USA) ,University of Califomia, [...]

2022-06-14 続きを読む...

Why Wafer Thinning Is Required?

From the perspective of the cross-sectional structure of integrated circuits, most integrated circuits are fabricated on the shallow surface layer of the silicon base material. Due to the requirements of the manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro lattice [...]

2022-06-13 続きを読む...

What Is Chamfer in Semiconductor Wafer ?

Chamfer is to grind away the sharp edges and corners around the wafer. Its purpose is to make the mechanical strength of the wafer bigger prevent the wafer edge from cracking, to prevent damage caused by thermal stress, and to increase the flatness of the epitaxial layer and the [...]

2022-06-10 続きを読む...