Custom Silicon Wafers

Custom Silicon Wafers

Custom Silicon Wafers

PAM XIAMEN offers custom silicon Wafers from thinning or reclaiming substrates that you already have to making silicon cubes.

We can laser cut or dice wafers into diameters and dimensions that you need.

Below is just some of the custom silicon wafer services that we provide

Low TTV (<1μm)
Low Bow/Warp (<5μm for 150mm)
Extra-Thin (100μm and thinner)
Extra-Thick (1 to 12mm)
Crystallographic orientations including (110), (112), (211), (510) and any offset to major directions (100) and (111)

Slicing
Lapping
Single-Side Polishing (SSP)
Double-Side Polishing (DSP)
Oxidation
Nitride
Thin Films
Silicon on Insulator
Ingots
Epitaxial silicon substrates

Small quantity orders are not a problem.

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.  PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.  PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.

2019-02-13

Share this post

Related Posts

4H SiC Epitaxial Wafers

PAM-XIAMEN, a leading SiC epitaxial wafer manufacturer, can offer 4H SiC epitaxial wafers for MOS fabrication, which refer to a single crystal film(epitaxial layer) with certain requirements and the same crystal growing on a silicon carbide substrate. The SiC epitaxial wafer market size is [...]

2021-05-17meta-author
Silicon Carbide Circuits

Silicon Carbide Circuits on the Way   Although silicon is the semiconducting material of choice in the majority of applications in electronics, its performance is poor where large currents at high voltages have to be controlled. For about 50 years, scientists have been eyeing silicon carbide [...]

2014-09-04meta-author , ,
Magnetic Czochralski (MCZ) Method

At present, silicon materials still occupy a major position in the field of semiconductors and solar energy. With the development of science and technology, the production process of integrated circuits and solar cells has put forward new requirements for silicon materials. The growth technology [...]

2022-09-15meta-author
Study on the Properties of Al Doped P-Type 4H-SiC by Liquid Phase Method

PAM-XIAMEN is available to offer P-type SiC substrates, please refer to: https://www.powerwaywafer.com/p-type-silicon-carbide-substrate-and-igbt-devices.html. The p-type substrate prepared by liquid-phase method can be applied to prepare IGBT devices and bipolar devices, solving the problem of missing p-type substrates in the SiC industry.  At present, significant breakthroughs have been made in [...]

2024-03-18meta-author
SrLaAlO4 crystal

PAM XIAMEN offers SrLaAlO4 crystal. SrLaAlO4 crystal is a promising substrate material for high Tc superconduct film and other oxide films to replace SrTiO3 crystal with better quality and lower cost. We produces SrLaAlO4 crystal and substrate in house up to 35 mm. We [...]

2019-05-14meta-author
Heterojunction AlGaAs / GaAs PIN Epitaxial Wafer

A 3-inch GaAs epitaxial wafer can be provided for making a PIN diode chip, which can make a power electronic device with high isolation and low insertion loss. A heterojunction AlGaAs/GaAs PIN wafer makes the diode with low RF on-state resistance suitable for fabricating various [...]

2021-11-02meta-author