Thinking thin brings new layering and thermal abilities to the semiconductor industry
This image shows a thick bulk gallium nitride (GaN) crystal wafer (2 inches in diameter) with a GaN film in the foreground fabricated by controlled spalling (its film thickness is ~20 microns or [...]
2017-07-26meta-author
PAM XIAMEN offers 6″FZ Prime Silicon Wafer.
Silicon wafers, per SEMI Prime,
P/E 6″ {150.0±0.5mm}Ø×1,000±25µm,
FZ p-type Si:B[111]±0.5°, Ro > 5,000 Ohmcm,
One-side-polished, Particles: <10@≥0.3µm,
back-side etched, One SEMI Flat (57.5mm), Edges: rounded,
Sealed in Empak or equivalent cassette,
BOW<30µm, MCCLifetime>1000µs.
For more information, [...]
2019-07-05meta-author
PAM-XIAMEN can supply GaN wafers for LD, LED, HEMT and other applications. You can click following links for more GaN wafer specifications:
GaN based LED epitaxial wafer: https://www.powerwaywafer.com/gan-wafer/epitaxial-wafer.html;
GaN HEMT epitaxial wafer: https://www.powerwaywafer.com/gan-wafer/gan-hemt-epitaxial-wafer.html;
Blue GaN LD wafer: https://www.powerwaywafer.com/blue-gan-ld-wafer.html.
Why you need to choose GaN wafers for power devices?
The short video: https://youtu.be/5Uk9HVzQWAc [...]
2022-09-26meta-author
The ultra-high voltage gate turn-off thyristor (GTO) device based on 4H-SiC, under the action of bidirectional carrier injection and conductivity modulation effects, can withstand high voltage while obtaining high pass current, meeting the requirements of ultra high power applications in terms of power density and [...]
2023-11-17meta-author
Highlights
•Effects of atomic step width on the removal of sapphire and SiC wafers are studied.
•The reason of effects of step width on the removal and the model are discussed.
•CMP removal model of hexagonal wafer to obtain atomically smooth surface is proposed.
•The variations of atomic [...]
2015-10-28meta-author
High-power broad-area InGaNAs/GaAs quantum-well (QW) edge-emitting lasers on GaAs substrates in the 1200 nm range are reported. The epitaxial layers of the InGaNAs/GaAs QW laser wafers were grown on n+-GaAs substrates by using metal-organic chemical vapor deposition (MOCVD). The thickness of the InGaNAs/GaAs QW layers [...]