ニュース

6インチのドープされていないGaAs基板、プライムおよびメカニカルグレード

PAM-XIAMEN supplies 6 inch undoped GaAs substrates, which are prime grade and mechanical grade grown by VGF. For wafer details, please view specifications listed below: 1. Prime Grade Undoped GaAs PAM220704-GaAs-Un Parameter GaAs-Un-6in-625um-PP UOM Growth method VGF   Grade Prime grade (Epi-ready)   Dopant Undoped   Orientation (100) ±0.5°   Orientation Angle N/A ° Diameter 150.0±0.2 mm Thickness 625±25 or 675±25 um Notch [010] ± 2°   Notch Depth 1.00-1.25 mm Notch Angle 89-95 ° CC N/A /cm3 [email protected] 22°C ≥1E8 ohm·cm Mobility [...]

シリコンウェーハの等方性エッチングと異方性エッチング

PAM-XIAMEN can provide etching silicon wafer in P type and N type, more specifications please see: https://www.powerwaywafer.com/silicon-wafer/etching-wafer.html. The etching of silicon wafers is divided into isotropy and anisotropy, shown as Fig. 1. Isotropy etching means that the etching rate of silicon in all directions is the same during the etching process, and the etching result is [...]

シリコン(Si)ウェーハを洗浄する方法は?

As the basis for making photovoltaic cells and integrated circuits, silicon wafer cleaning is very important. The effect of cleaning directly affects the final performance, efficiency and stability of photovoltaic cells and integrated circuits. Cleaning the silicon wafer not only removes impurities on the surface of the silicon wafer [...]

内因性および外因性半導体についての何か

There are three basic types of semiconductor materials: intrinsic semiconductors, extrinsic semiconductors, also known as impurity semiconductors. Both types of semiconductor materials can be supplied by PAM-XIAMEN. 1. What Is Intrinsic Semiconductor? Intrinsic semiconductor refers to a pure semiconductor that is completely free of impurities and lattice defects, and generally such [...]

Silicon Vacancy (Vsi) — Spin Color Center in Silicon Carbide

Solid-state spin color center is an important research platform for quantum information processing, and diamond nitrogen vacancy (NV) color center is its outstanding representative. Since the detection of a single diamond NV color center at room temperature was reported by a German research team in 1997, important progress has [...]

Why Wafer Thinning Is Required?

From the perspective of the cross-sectional structure of integrated circuits, most integrated circuits are fabricated on the shallow surface layer of the silicon base material. Due to the requirements of the manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro lattice [...]

What Is Chamfer in Semiconductor Wafer ?

Chamfer is to grind away the sharp edges and corners around the wafer. Its purpose is to make the mechanical strength of the wafer bigger prevent the wafer edge from cracking, to prevent damage caused by thermal stress, and to increase the flatness of the epitaxial layer and the [...]