製品

PAM-XIAMEN offers Gallium Nitride wafer substrate for UHB-LED,Gallium Nitride wafer,LD and other semiconductor devices.

Silicon Carbide（SiC) Wafers PAM-XIAMEN offers Silicon Carbide crytal wafers and epitaxy,which is used for Optoelectronic Devices,High Power Devices,High Temperature Devices,High Frequency Power Devices

PAM-XIAMEN offers Gallium Arsenide wafer substrate and epitaxy for LED,LD and Microelectronics applications

PWAM offers semiconductor materials,(Ge)Germanium Single Crystals and Wafers grown by VGF / LEC

PAM-XIAMEN, a silicon wafer manufacturing company, offers silicon wafer: FZ Silicon wafer, Test Wafer Monitor Wafer Dummy Wafer, Test Wafer,CZ wafer, epitaxial wafer, polished wafer, etching wafer.

The silicon wafer manufacturing process is crystal pulling, silicon wafer dicing, silicon wafer grinding, chamfering, etching, polishing, cleaning and inspection, among which crystal pulling, silicon wafer polishing and inspection are the core links of silicon wafer manufacturing. As the basic semiconductor substrate, silicon wafers must have high standards of purity, surface flatness, cleanliness, and impurity contamination to maintain the original designed functions of the chip. The high-specification requirements of semiconductor silicon wafers make its manufacturing process complicated. The four core steps include polysilicon purification and polysilicon ingot casting, single crystal silicon wafer growth, and silicon wafer cutting and shaping. As a raw material for wafer fab, the quality of silicon wafers directly determines the stability of the silicon wafer application process. Large-size silicon wafers have become the future development trend of silicon wafers. In order to improve production efficiency and reduce costs, more and more large-size silicon wafers are used.