Low Stress Nitride Silicon Wafers
PAM XIAMEN offers Low Stress Nitride Silicon Wafers.
Why use low stress nitride on your silicon wafers? Some uses include surface micromachining process that can fabricate the micromechanical structures when internal tensile stress and native nonporous morphology is required.
Thickness range: 50Å – 2µm
Thickness tolerance: +/-5%
Within wafer uniformity: +/-5% or better
Wafer to wafer uniformity: +/-5% or better
Sides processed: both
Refractive index: 2.20 +/-.02
Film stress: <250MPa Tensile Stress
Wafer size: 50mm, 100mm, 125mm, 150mm, 200mm
Wafer thickness: 100µm – 2,000µm
Wafer material: Silicon, Silicon on Insulator, Quartz
Gases: Dichlorosilane, Ammonia
Equipment: Horizontal vacuum furnace
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
Quality is our first priority. PAM-XIAMEN has been ISO9001:2008, owns and shares four modern facories which can provide quite a big range of qualified products to meet different needs of our customers, and every order has to be handled through our rigorous quality system. Test report is provided for each shipment, and each wafer are warranty.