News

Aberration-corrected transmission electron microscopy analyses of GaAs/Si interfaces in wafer-bonded multi-junction solar cells

Highlights •Aberration-corrected TEM and EELS reveal structural and elemental profiles across GaAs/Si bond interfaces in wafer-bonded GaInP/GaAs/Si – multi-junction solar cells. •Fluctuations in elemental concentration in nanometer-thick amorphous interface layers, including the disrubutions of light elements, are measured using EELS. •The projected widths of the interface layers are determined on the atomic [...]

Monitoring defects in III–V materials: A nanoscale CAFM study

Highlights •Nanoscale defects in III–V materials, grown over Si were characterized with CAFM. •The defects exhibit higher conductivity. •The contact rectifying feature is hide by a larger current under the reverse bias. •Patterned samples fabricated using Aspect Ratio Trapping were also characterized. Abstract The implementation of high mobility devices requires growing III–V materials on silicon [...]

Layer structure of 703nm Laser

Layer structure of 703nm Laser   We can offer Layer structure of 703nm Laser as follows:   Layer Composition Thickness (um) Doping(cm-3) Cap P+- GaAs 0.2 Zn:>1e19 Cladding p – Al0.8Ga0.2As 1 Zn:1e18 Etch stop GaInP 0.008 Zn:1e18 Top barrier Al0.45Ga0.55As 0.09 Undoped Well Al0.18Ga0.82As 0.004 Undoped Barrier Al0.45Ga0.55As 0.01 Undoped Well Al0.18Ga0.82As 0.004 Undoped Barrier Al0.45Ga0.55As 0.01 Undoped Well Al0.18Ga0.82As 0.004 Undoped Bottom barrier Al0.45Ga0.55As 0.09 Undoped Cladding n – Al0.8Ga0.2As 1.4 Si:1e18 Buffer n – GaAs 0.5 Si:1e18 Substrate n+ – GaAs   S :>1e18   Source:PAM-XIAMEN   For more information, please visit our website:https://www.powerwaywafer.com/, send us email at sales@powerwaywafer.com  or powerwaymaterial@gmail.com.

Three-dimensional InP-DHBT on SiGe-BiCMOS integration by means of Benzocyclobutene based wafer bonding for MM-wave circuits

Highlights •Fabrication scheme for heterogenous Si-to-InP circuits on wafer level is described. •Wafer-to-wafer alignment accuracy better than 4–8 μm after bonding obtained. •Interconnects with excellent performance up to 220 GHz demonstrated. •Palladium barrier necessary when combining Al-based technology with gold based one. Abstract In order to benefit from the material properties of both InP-HBT and SiGe-BiCMOS technologies [...]

Gain characteristics and femto-second optical pulse response of 1550 nm-band multi-stacked QD-SOA grown on InP(311)B substrate

Gain characteristics and femto-second optical pulse response of 1550 nm-band multi-stacked QD-SOA grown on InP(311)B substrate In this paper, we demonstrated 155 nm-band multi-stacked QD-SOA grown by the strain-compensation technique on an InP(311)B substrate, and evaluated the fundamental gain characteristics and the femto-second optical pulse response, for the application to ultra-fast [...]

InP Epitaxial Wafers

Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) offers the highest purity InGaAs / InP Epitaxial Wafer in the industry today. Sophisticated manufacturing processes have been put in place to customize and produce high quality InP (Indium Phosphide) Epitaxial wafers up to 4 inches with wavelengths from 1.7 to 2.6μm, ideally suited for high speed, [...]