2″ Silicon Wafer-1

2″ Silicon Wafer-1

PAM XIAMEN offers 2″ Silicon Wafer.

Material Orient. Diam. Thck
(μm)		 Surf. Resistivity
Ωcm		 Comment
p-type Si:B [110] ±0.5° 2″ 279 P/E FZ >1,000
p-type Si:B [100] 2″ 300 P/E FZ 2,800-3,300 SEMI Prime, TTV<7μm
p-type Si:B [100] 2″ 300 P/E FZ 2,800-3,300 SEMI Prime, TTV<7μm
p-type Si:B [100] 2″ 300 P/E FZ 2,800-3,300 SEMI Prime, TTV<7μm
p-type Si:B [111] ±0.5° 2″ 500 P/P FZ 5,000-6,500 SEMI Test (in unsealed cassette)
p-type Si:B [111] ±0.5° 2″ 275 P/E FZ 3,000-5,000 SEMI Prime, Lifetime>2,000μs, in hard cassettes of 5 wafers
p-type Si:B [111-7° towards[110]] ±0.5° 2″ 279 P/P FZ >2,000 SEMI Prime
p-type Si:B [111] ±0.5° 2″ 331 P/E FZ 2,000-5,000 SEMI, Soft cst
p-type Si:B [111] ±0.5° 2″ 331 P/E FZ 2,000-5,000 SEMI TEST (Scratched), Soft cst
p-type Si:B [111] ±0.5° 2″ 331 P/E FZ 2,000-5,000 SEMI Prime, in Soft cassettes of 4 wafers
p-type Si:B [111] 2″ 381 P/E FZ 2,000-5,000 SEMI TEST (Wafers scratched and cannot be recleaned), hard cst
p-type Si:B [111] ±0.5° 2″ 280 ±15 P/E FZ >1,000 SEMI,
p-type Si:B [111] ±0.5° 2″ 275 P/P FZ 1-10 SEMI Prime
n-type Si:P [110] ±1° 2″ 525 P/E FZ 5,000-10,000 SEMI Prime, Lifetime>1,000μs, Primary Flat @ [111]±0.5°, Secondary Flat @ [111] 70.5° CW from Primary, in hard cassettes of 7, 8 & 8 wafers
n-type Si:P [110] ±1° 2″ 525 P/E FZ 5,000-10,000 SEMI Prime, Lifetime>1,000μs, Primary Flat @ [111]±0.5°, Secondary @ [111] 70.5° CW from Primary
n-type Si:P [110] ±0.5° 2″ 400 P/E FZ 4,000-20,000 SEMI, Lifetime>1,000μs
n-type Si:P [110] 2″ 900 P/E FZ 130-350 SEMI Prime
n-type Si:P [110] ±0.5° 2″ 900 P/E FZ 50-100 SEMI Prime, Primary Flat only at [111]±0.5°
n-type Si:P [100] 2″ 430 P/E FZ >5,000 Prime, TTV<5μm
n-type Si:P [100] 2″ 300 P/E FZ >600 SEMI Prime,
n-type Si:P [100] 2″ 300 P/E FZ >600 {1,400-2,000} SEMI Prime,

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

Our goal is to meet all of your requirements, no matter how small orders and how difficult questions they may be,
to maintain sustained and profitable growth for every customer through our qualified products and satisfying service.

2019-03-07

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