сапфире

сапфире

High-quality sapphire wafers are available from 2 inch to 8 inch with A, C, M or R plane. Monocrystal sapphire wafer is a very difficult material to process, so it is often used as a material for optoelectronic components. At present, the quality of ultra-high-brightness white/blue LEDs depends on the material quality of gallium nitride epitaxy (GaN), and the quality of LED GaN epitaxy is closely related to the surface processing quality of the sapphire substrate wafer. The lattice constant mismatch rate between C-plane sapphire and the II-V and II-VI group deposited films is small, and it meets the high temperature resistance requirements in the GaN epitaxial process, making the sapphire wafer a key material for the production of white/blue/green LEDs. As one of sapphire wafer suppliers, PAM-XIAMEN offers you following sapphire wafer specifications:

C-Plane Sapphire wafer

2 сапфира WAFER A-САМОЛЁТА 11-20 МОНОКРИСТАЛЛ al2o3

Материал: высокая чистота> 99,996%, монокристалл Al2O3
Dimension: Φ50.8 mm ± 0.1 mm
Thickness: 0.50 mm standard
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: A-plane (11-20) 0.2± 0.1 degree off.
Primary Flat Orientation: C-plane
Primary flat length: 16.0 ± 1 mm
Total Thickness Variation: <10 μm
Bow: <10 μm
Warp: <10 μm
Polishing: single side polished Ra < 0.5 nm (AFM), double size polish is available per request.

2 сапфира WAFER M-САМОЛЁТА 10-10 МОНОКРИСТАЛЛ al2o3

Материал: высокая чистота> 99,996%, монокристалл Al2O3
Dimension: Φ50.8 mm ± 0.1 mm
Thickness: 0.43 mm standard
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: M-plane (10-10) 0.2± 0.1 degree off.
Primary flat orientation: C-plane[11-20] +/- 0.2°
Primary flat length: 16.0 ± 1 mm
Total Thickness Variation: <10 μm
Bow: <10 μm
Warp: <10 μm
Polishing: single side polished Ra < 0.5 nm (AFM), double size polish is available per request.

2 сапфира WAFER R-САМОЛЁТА 1-102 МОНОКРИСТАЛЛ al2o3

Материал: высокая чистота> 99,996%, монокристалл Al2O3
Dimension: Φ50.8 mm ± 0.1 mm
Thickness: 0.43 mm standard
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: R-plane (1-102) 0.2± 0.1 degree off.
Primary Flat orientation: Projected C-Axis 45 +/- 2 degree
Primary flat length: 16.0 ± 1 mm
Total Thickness Variation: <10 μm
Bow: <10 μm
Warp: <10 μm
Polishing: single side polished Ra < 0.5 nm (AFM), double size polish is available per request.

2 ДЮЙМОВЫЕ САПФИРА ВАФЛЯ С-САМОЛЕТ одной или двух сторон ПОЛЬСКО AL2O3 МОНОКРИСТАЛЛ

Материал: высокая чистота> 99,99%, монокристалл Al2O3
Dimension: Φ50.8 mm ± 0.1 mm
Thickness: 430 um ± 25 um for SSP and 400 um ± 25 um for DSP (other thickness available upon request)
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: C plane (0001) to M (1-100) 0.2 ± 0.1 degree off.
Primary Flat Orientation: A-plane [11-20] +/- 0.2°
Primary Flat Length: 16.0 ± 1.0 mm
Total Thickness Variation (TTV): <5 μm
Bow: <10 μm
Warp: <10 μm
Polishing: single side polished (SSP) front side epi-ready surface Ra < 0.3 nm (AFM), back side fine-ground Ra = 0.8 ~ 1.2 um, or double side polished (DSP) both front and back sides epi-ready surface Ra < 0.3 nm (AFM)

3 ДЮЙМОВЫЕ САПФИРА ВАФЛЯ С-САМОЛЕТ одной или двух сторон ПОЛЬСКО AL2O3 МОНОКРИСТАЛЛ

Материал: высокая чистота> 99,99% монокристалл Al2O3
Diameter: Φ76.2 mm ± 0.1 mm
Thickness: 650 um ± 25 um (SSP) , 600 or 430 um ± 25 um (DSP)
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: C plane (0001) ± 0.3 degree, R-plane (1-102), A-plane (11-20), M-plane (10-10) are available.
Primary flat orientation: A-plane ± 0.3 degree
Primary flat length: 22.0 mm ± 1 mm
Total Thickness Variation (TTV): <15 μm
Bow: <15 μm
Warp: <15 μm
Polishing: single side polished (SSP) front side epi-ready surface Ra < 0.5 nm (AFM), back side fine-ground Ra = 0.8 ~ 1.2 um, or double side polished (DSP) both front and back sides epi-ready surface Ra < 0.5 nm (AFM)

4 ДЮЙМОВЫЕ САПФИРА ВАФЛЯ С-САМОЛЕТ одной или двух сторон ПОЛЬСКО AL2O3 МОНОКРИСТАЛЛ

Материал: высокая чистота,> 99,99%, монокристалл Al2O3
Dimension: Φ100.0 mm ± 0.1 mm
Thickness: 650 um ± 25 um (SSP) , 600 um ± 25 um (DSP)
Lattice Parameter: a=4.785 A, c=12.991 A
Density: 3.98 g/cm3
Orientation: C plane sapphire (0001) off M plane 0.2± 0.1 degree, R-plane (1-102), A-plane (11-20), M-plane (10-10) are available.
Primary flat orientation: A-plane ± 0.2 degree
Primary flat length: 30.0 ± 1 mm
Total Thickness Variation (TTV): <20 μm
Bow: <20 μm
Warp: <20 μm
Polishing: single side polished (SSP) front side epi-ready surface Ra < 0.5 nm (AFM), back side fine-ground Ra = 0.8 ~ 1.2 um, or double side polished (DSP) both front and back sides epi-ready surface Ra < 0.5 nm (AFM)

6 inch C-plane (0001) Sapphire Substrate (PAM210910-S)

Item Specification
Material High Purity Al2O3
Growth Method KY
Surface Orientation C-plane (0001) off Angle 0.2°±0.1°(M-axis); 0°±0.1°(A-axis)
Diameter 150±0.2mm
Thickness 1300±25um
TTV ≤15um
Bow -20~0um
Warp ≤25um
Wafer Edge T-type or R-type
R-plane R9
Primary Flat Orientation A-plane±0.2°
Primary Flat Length Semi-notch/47.5±1.5mm
Front Surface Roughness Ra≤0.3nm
Back Surface Roughness 0.8~1.2um
Laser Mark Back or Front Side (Backside Preferred)
Package 25pcs/cassette, vacuum-sealed, nitrogen-filled, class-100 cleanroom

 

Sapphire Wafer 200mm (PAM210910-S)

Item Specification
Material High Purity Al2O3
Surface Orientation C-plane (0001) off Angle 0°±0.3°(M-axis)
Diameter 200±0.25mm
Thickness 725±25um
TTV ≤20um
Bow -30~0um
Warp ≤25um
Wafer Edge T-type or R-type
R-plane R9 or R3
Primary Flat Orientation A-plane±0.2°
Primary Flat Length Semi-notch/Design by customer
Front Surface Roughness Ra≤0.3nm
Back Surface Roughness 0.8~1.2um
Laser Mark Back or Front Side (Backside Preferred)
Package 25pcs/cassette, vacuum-sealed, nitrogen-filled, class-100 cleanroom

 

 

C-Plane Sapphire Substrate

R-Plane Sapphire Substrate with SSP

 

For more information, please contact us email at victorchan@powerwaywafer.com и powerwaymaterial@gmail.com.

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